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Thermally conductive composition and thermally conductive sheet using same

A technology of thermal conductivity and composition, which is applied in the field of thermally conductive sheet and thermally conductive composition, and can solve the problems of low thermal conductivity and difficulty in following the heating part.

Active Publication Date: 2022-04-01
FUJI POLYMER INDUSTRIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the conventional thermally conductive silicone sheet has the problems of being difficult to follow the unevenness of the heat generating part and / or heat dissipation part, and the thermal conductivity is low, so it needs to be improved.

Method used

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  • Thermally conductive composition and thermally conductive sheet using same
  • Thermally conductive composition and thermally conductive sheet using same
  • Thermally conductive composition and thermally conductive sheet using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0098] 1. Material composition

[0099] (1) Polyorganosiloxane (component A)

[0100] Use a two-component room temperature curing silicone polymer (silicone component) containing polyorganosiloxane. In one solution (A1 liquid), it contains the base polymer component and platinum group metal catalyst, and in the other solution (A two-component), it contains the base polymer component and the crosslinking agent component that is organohydrogenpolysiloxane .

[0101] (2) Thermally conductive particles (B component)

[0102] Five types of heat conductive particles listed in Table 1 were used. Add a silane coupling agent (octyltriethoxysilane) to the alumina particles in a ratio of 1% by mass, and stir until it becomes uniform. Spread the stirred alumina particles uniformly on a tray or the like, and heat at 100°C Surface treatment was carried out by drying for 2 hours. Thereby, the catalytic ability of the Pt catalyst, that is, the curing reaction is prevented from being impa...

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Abstract

The thermally conductive composition of the present invention includes a matrix resin, a curing catalyst, and thermally conductive particles, and the thermally conductive particles include (a) 900 parts by mass or more of aluminum nitride having an average particle diameter of 50 μm or more, with respect to 100 parts by mass of the matrix resin component, (b) more than 400 parts by mass of aluminum nitride with an average particle diameter of 5 μm or less and (c) more than 0 parts by mass and 400 parts by mass of aluminum oxide with an average particle diameter of 6 μm or less, the heat conduction of the cured product of the above-mentioned thermally conductive composition The coefficient is above 12W / m·K, and the ASKER C hardness is 20-75. Thereby, the thermally conductive composition which has hardness suitable for being attached to an electric / electronic component etc., and high thermal conductivity, and the thermally conductive sheet using the same are provided.

Description

technical field [0001] The present invention relates to a thermally conductive composition suitable for sandwiching between a heat generating portion of an electric / electronic component and a radiator, and a thermally conductive sheet using the same. Background technique [0002] The performance of semiconductors such as CPUs has been dramatically improved in recent years, and the amount of heat generated has also become enormous. Therefore, heat sinks are attached to electronic components that generate heat, and thermally conductive silicone sheets are used to improve the adhesion between semiconductors and heat sinks. Along with miniaturization, high performance, and high integration of equipment, flexibility and high thermal conductivity are required for thermally conductive silicone sheets. Conventionally, Patent Documents 1 to 4 and the like have been proposed as thermally conductive silicone gel sheets. [0003] prior art literature [0004] patent documents [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K3/20C09K5/14C08K3/28C08L83/05C08L83/07C08L101/00
CPCC08K3/22C08K3/28C08K2003/2227C08K2003/282C08K2201/001C08K2201/005C08K2201/014C09K5/14C08L83/10C08K5/54C08K3/10C08K2201/002C08L83/04C08G77/04H05K7/2039
Inventor 铃村克之
Owner FUJI POLYMER INDUSTRIES CO LTD
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