Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Positioning method, device, apparatus compatible with multiple chips and medium

A positioning device and multi-chip technology, applied in image enhancement, instrumentation, image feedback, etc., can solve problems such as poor compatibility and difficult target position positioning

Pending Publication Date: 2020-12-11
深圳市大族半导体装备科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many types of integrated control chips, and different types of integrated control chips are different in size, hole position, thickness and other parameters, which also makes it difficult for printing equipment to locate the target position on the integrated control chip. The compatibility of different chips for precise positioning is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Positioning method, device, apparatus compatible with multiple chips and medium
  • Positioning method, device, apparatus compatible with multiple chips and medium
  • Positioning method, device, apparatus compatible with multiple chips and medium

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0043] Such as figure 1 as shown, figure 1 for figure 1 It is a schematic flow chart of the compatible multi-chip positioning method in the first embodiment. The steps provided by the compatible multi-chip positioning method in the first embodiment include:

[0044] Step 102, acquiring positioning parameters of at least one chip, and transmitting at least one positioning parameter to a controller of the positioning device.

[0045] Among them, the positioning parameters refer to the equipment configuration parameters used to locate the positioning point of the chip, including: equipment platform height, equipment track width, chip loading position, and chip unloading position. In this implementation scenario, the positioning parameters may also specifically include: the standby position of the jaws, the clamping position of the jaws, and the like. Due to the different chip parameters such as size, thickness, hole position, etc., in order to realize the positioning operation...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a positioning method compatible with multiple chips, and the method comprises the steps: obtaining a positioning parameter of at least one chip, and transmitting the at least one positioning parameter to a controller of a positioning apparatus acquiring information of a target chip, taking the positioning parameter corresponding to the target chip as a target positioning parameter, and displaying a target parameter name of the target positioning parameter; judging whether the target parameter name matches current positioning hardware currently installed in the positioning apparatus or not; and if the target parameter name matches current positioning hardware, driving the current positioning hardware to execute positioning operation according to the target positioning parameter so as to drive the current positioning hardware to move to the target positioning point. Therefore, the positioning operation compatible with different chips is realized, and the processing capacity of the chips is further improved. In addition, the invention further provides positioning device compatible with the multiple chips, computer equipment and a storage medium.

Description

technical field [0001] The invention relates to the technical field of chip processing, in particular to a compatible multi-chip positioning method, device, equipment and medium. Background technique [0002] After the integrated control chip is sealed and molded, it is necessary to print the chip information on its specific position to indicate the attribute information of the chip. However, there are many types of integrated control chips, and different types of integrated control chips are different in size, hole position, thickness and other parameters, which also makes it difficult for printing equipment to locate the target position on the integrated control chip. The compatibility of different chips for precise positioning is poor. Contents of the invention [0003] Based on this, it is necessary to provide a compatible multi-chip positioning method, device, equipment and medium for the above problems. [0004] A method compatible with multi-chip positioning, appl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06T7/73G06T1/00G06F16/903B41F33/00
CPCG06T7/74G06T1/0014G06F16/90335B41F33/00G06T2207/30148
Inventor 王枫刘盛鲁恋情赵鹏升张一谋史磊高云峰
Owner 深圳市大族半导体装备科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com