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Aggregated and Virtualized Solid State Drives Accessed via Multiple Logical Address Spaces

A solid-state drive, logic address technology, applied in the field of memory systems, can solve problems such as the volatility of memory integrated circuits

Pending Publication Date: 2020-12-25
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some memory integrated circuits are volatile and require power to maintain stored data

Method used

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  • Aggregated and Virtualized Solid State Drives Accessed via Multiple Logical Address Spaces
  • Aggregated and Virtualized Solid State Drives Accessed via Multiple Logical Address Spaces
  • Aggregated and Virtualized Solid State Drives Accessed via Multiple Logical Address Spaces

Examples

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Embodiment Construction

[0021] At least some aspects of the present disclosure are directed to techniques for aggregating multiple memory subsystems into a combined memory subsystem that acts as a single memory subsystem for a host system. In some embodiments, a single memory subsystem is configured with multiple host interfaces to serve multiple host systems, or to serve one host system via multiple parallel and / or redundant connections.

[0022] Currently, solid state drives (SSDs) can be provided in a single integrated circuit package. For example, solid state drives (SSDs) may be packaged in a ball grid array (BGA) form factor. The BGA SSD has a controller embedded in the integrated circuit package to process commands from the host system, control operations for accessing data in media units or memory components embedded in the BGA SSD, and generate responses to commands from the host system . However, a single integrated circuit package and / or BGA form factor may limit the storage capacity of ...

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PUM

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Abstract

A solid state drive having a drive aggregator and multiple component solid state drives. The drive aggregator associates the host interfaces with different logical address spaces, interprets commandsreceived from the host interfaces in the different logical address spaces, and implements the commands using the plurality of component solid state drives. Some of the host interfaces can be configured to share a common logical address space. Some of the logical address spaces can be configured to have an overlapping region that are hosted on the same set of memory units such that the memory unitscan be addressed in any of the logical address spaces having the overlapping region.

Description

technical field [0001] At least some embodiments disclosed herein relate generally to memory systems, and more specifically, but not limited to, aggregation and virtualization of solid state drives that can be accessed using separate logical address spaces. Background technique [0002] The memory subsystem may be a storage system such as a solid state drive (SSD) or a hard disk drive (HDD). The memory subsystem may be a memory module, such as a dual in-line memory module (DIMM), a small outline DIMM (SO-DIMM), or a non-volatile dual in-line memory module (non-volatile dual in-line memory module, NVDIMM). A memory subsystem may include one or more memory components that store data. The memory components can be, for example, non-volatile memory components and volatile memory components. Examples of memory components include memory integrated circuits. Some memory integrated circuits are volatile and require power to maintain stored data. Some memory integrated circuits a...

Claims

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Application Information

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IPC IPC(8): G06F3/06G06F12/02
CPCG06F3/0659G06F3/0683G06F12/0246G06F2212/7201G06F13/404G06F13/382G06F3/0688G06F3/0604G06F3/0664G06F3/0638G06F12/0238G06F3/0617G06F3/0655G06F12/0223G06F3/0668G06F3/0661G06F12/10G06F12/0292G06F12/0284
Inventor C·J·比布普尔纳·卡利
Owner MICRON TECH INC