A highly integrated brick tr component

Abstract

A high-integration brick-type TR assembly includes: a housing, a radio frequency circuit board, an inner cover, and an outer cover. One end surface of the housing has an installation cavity, the side wall of the installation cavity is provided with a radio frequency output terminal connector and a low frequency connector, and the opposite side wall is provided with a radio frequency antenna terminal connector, and there are 24 radio frequency antenna terminal connectors. The RF circuit board is located in the installation cavity. The front side of the RF circuit board is RF and digital components, and the reverse side is RF microstrip lines. The RF circuit board and the RF antenna end connector are connected to the RF circuit board, and the RF circuit board is equipped with a multi-function chip and a power modulation module corresponding to the RF antenna end connector. A shielding chamber is arranged on the bottom surface of the inner cover, the inner cover is arranged on the radio frequency circuit board, and the multifunctional chip is arranged in the shielding chamber. The outer cover is used to seal the installation cavity. The multi-channel integrated design reduces the volume of brick-type TR components, and has better sealing performance, which is convenient for detection and debugging.

Description

technical field [0001] The invention belongs to the technical fields of radar, telemetry and communication, and in particular relates to a highly integrated brick-type TR assembly. Background technique [0002] With the development of the times, active phased array radar has been more and more widely used due to its unique performance indicators, high integration and weight advantages, and has a tendency to completely replace traditional radar. The TR component is the core component of the active phased array radar, and its performance index and volume directly determine the performance of the active phased array radar equipment. Based on this, under the premise of ensuring the electrical performance index, TR components are gradually developing towards miniaturization and integration. At present, traditional TR components usually integrate a small number of channels, and the function of the channel chip is relatively single, resulting in high cost of TR components, low deg...

AI Technical Summary

Problems solved by technology

At present, traditional TR components usually integrate a small number of channels, and the function of the channel chip is relatively single, resulting in high cost of TR components, low degree of integration, and poor consistency of batch production indicators.

[0003] At present, the multi-channel integration of TR components is mainly limited by the relatively single function of the chip, and the number of chips used in a single channel of the component is large.

As a result, during multi-channel integration, the indicators of each channel are quite different, the consistency of batch production indicators is poor, the workload of debugging is large, and the volume has no obvious advantages compared with traditional TR components. The above factors are the main reasons why TR components cannot be highly integrated.

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