Substrate structure, packaging structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric-solid-state devices, etc., can solve the problems of long process, high cost, and many materials, achieve optimal structural stability, and save manufacturing costs. Effect
Pending Publication Date: 2020-12-29
何崇文
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Problems solved by technology
Using this method to form a circuit substrate with embedded electronic components, the core substrate will eventually become a part of the final product, so the core substrate cannot be reused, and the thickness of the final product is thicker, and more materials are used. Longer makes the cost higher
Method used
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[0095] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.
[0096] Figure 1A to Figure 1I It is a schematic cross-sectional view of a manufacturing method of a packaging structure according to an embodiment of the present invention; regarding the manufacturing method of the packaging carrier of this embodiment, first, please refer to Figure 1A , providing stainless steel plate 110. The stainless steel plate 110 has an upper surface 112 and a lower surface 114 opposite to each other and a side surface 116 connecting the upper surface 112 and the lower surface 114 . The upper surface 112 has an upper central region C1 and an upper peripheral region P1 surrounding the upper central region C1 . The lower surface 114 has a lower central area C2 and a lo...
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The invention provides a substrate structure, a packaging structure and a manufacturing method thereof. The substrate structure comprises a stainless steel plate, a first insulating material layer anda second insulating material layer, wherein the stainless steel plate has an upper surface, a lower surface and a side surface connecting the upper surface and the lower surface; the upper surface has an upper central region and an upper peripheral region; the lower surface has a lower central region and a lower peripheral region; the first insulating material layer covers the upper peripheral region, the lower peripheral region, and the side surface of the stainless steel plate; the second insulating material layer is connected with the first insulating material layer and covers the upper central area and the lower central area of the stainless steel plate; the second insulating material layer has a first element arrangement hole and a second element arrangement hole; the first element configuration hole and the second element configuration hole expose a part of the upper surface and a part of the lower surface of the stainless steel plate respectively. The substrate structure can berepeatedly used, so manufacturing of the packaging structure has fewer manufacturing steps, and manufacturing cost can be effectively saved.
Description
technical field [0001] The invention relates to a substrate, a packaging structure and a manufacturing method thereof, in particular to a reusable substrate structure, a packaging structure manufactured by using the substrate structure and a manufacturing method thereof. Background technique [0002] Generally speaking, for circuit substrates with embedded electronic components, the electronic components are embedded in the slots of the core substrate first, and then build-up circuit layers are formed on both sides of the substrate to electrically connect the electronic components in the slots. Using this method to form a circuit substrate with embedded electronic components, the core substrate will eventually become a part of the final product, so the core substrate cannot be reused, and the thickness of the final product is thicker, and more materials are used. Longer makes the cost higher. Contents of the invention [0003] The invention is aimed at a substrate structu...
Claims
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IPC IPC(8): H01L21/683H01L21/56H01L23/31
CPCH01L21/6835H01L21/568H01L23/3107H01L2221/68386H01L2221/68372H01L2224/18
Inventor 何崇文
Owner 何崇文