Housing assembly, antenna assembly and electronic device
A technology of a casing assembly and an antenna device, which is applied in the electronic field, can solve the problems of a large influence on the radiation performance of the antenna device, and achieve the effect of changing the radiation performance.
Active Publication Date: 2021-10-22
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In related technologies, the dielectric substrate in the environment where the antenna device is located has a great influence on the radiation performance of the antenna device
Method used
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[0041] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the accompanying drawings in the embodiments of the application. Apparently, the described embodiments are only part of the embodiments of the application, not all of them. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0042] Please also refer to figure 1 , figure 2 with image 3 , the housing assembly 10 provided in the embodiment of the present application includes a dielectric substrate 100, a carrying film layer 200 and a coupling structure 300, the dielectric substrate 100 has a first transmittance to a radio frequency signal of a preset frequency band, and the carrying film layer 200 Laminated with the dielectric substrate 100, the coupling structure 300...
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Abstract
The application provides a shell assembly, an antenna device and electronic equipment. The housing assembly includes a dielectric substrate, a carrying film layer and a coupling structure, and the dielectric substrate has a first transmittance to a radio frequency signal of a preset frequency band; the carrying film layer is stacked with the dielectric substrate; the coupling The structure is arranged on the carrying film layer, the orthographic projection of the coupling structure on the dielectric substrate covers at least a partial area of the dielectric substrate, the coupling structure includes one or more coupling element array layers, and the coupling The element array layer has a resonance feature in the preset frequency band; the housing component has a second transmittance for radio frequency signals in the preset frequency band in the region corresponding to the coupling structure, and the second The transmittance is greater than the first transmittance. Different regions of the housing assembly provided by the embodiments of the present application have different transmittances to radio frequency signals, and when the housing assembly is applied to an antenna, the radiation performance of the antenna can be improved.
Description
technical field [0001] The present application relates to the field of electronic technology, and in particular to a housing assembly, an antenna device and electronic equipment. Background technique [0002] Millimeter wave has the characteristics of high carrier frequency and large bandwidth, and is the main means to realize the ultra-high data transmission rate of the fifth generation (5th-Generation, 5G). At present, many well-known mobile terminal equipment manufacturers in the world have planned to implement 5G functions as the standard configuration of their new generation of mobile terminal products. In related technologies, the dielectric substrate in the environment where the antenna device is located has a great influence on the radiation performance of the antenna device. Contents of the invention [0003] The present application provides a shell assembly, an antenna device and electronic equipment, so as to reduce the impact of the shell assembly on the radia...
Claims
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IPC IPC(8): H05K5/02H01Q21/06H01Q5/307H01Q5/20H01Q5/10H01Q1/52H01Q1/50H01Q1/48H01Q1/24H01Q1/22
CPCH05K5/0247H01Q1/523H01Q1/50H01Q1/48H01Q5/10H01Q5/20H01Q5/307H01Q21/065H01Q1/243H01Q1/2266H01Q1/22H01Q9/045H01Q1/38H01Q15/006H01Q15/0026H01Q1/422H01Q1/425H01Q13/20H01Q5/30H01Q5/35H01Q5/28
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD