A driver, an electronic device and a control method for the driver

Abstract

It relates to the technical field of heat conduction between driver components, and the present application discloses a driver, electronic equipment, and a control method for the driver. It includes a first substrate and a second substrate. The first basic substrate and the second substrate are used to install electronic components. It also includes an adjustment piece. The adjustment piece is connected to the first substrate and the second substrate at intervals. The two ends of the adjustment piece are respectively connected to the first substrate and The second substrate, the adjusting member can change the distance between the first substrate and the second substrate by stretching or shrinking. Compared with the prior art, the distance between the first substrate and the second substrate can be changed through the elongation or contraction of the adjustment member, thereby changing the heat conduction efficiency between the first substrate and the second substrate. In a low temperature environment, The working temperature between different electronic components can be adjusted by using the waste heat of the electronic components in the driver, so as to effectively improve the working efficiency of the electronic equipment and prolong the service life of the electronic equipment.

Description

technical field [0001] The present application relates to the technical field of heat conduction between driver components, and in particular, relates to a driver, an electronic device, and a control method for the driver. Background technique [0002] Different electronic components have a rated operating temperature, that is, the rated temperature. Electronic devices operating within the rated temperature range have the best working efficiency, and the service life will be extended accordingly. When the electronic components are often subject to excessive self-heating Or the lower ambient temperature will affect the normal operation of the entire PCB board, that is, when the operating temperature of the electronic components is lower than or higher than the rated temperature range, the working efficiency between the components will be reduced accordingly. [0003] The drivers in the prior art are mostly used in the normal temperature environment, and the electronic compone...

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Problems solved by technology

[0002] Different electronic components have a rated operating temperature, that is, the rated temperature. Electronic devices operating within the rated temperature range have the best working efficiency, and the service life will be extended accordingly. When the electronic components are often subject to excessive self-heating Or the lower ambient temperature will affect the normal operation of the entire PCB board, that is, when the operating temperature of the electronic components is lower or higher than the rated temperature range, the working efficiency between the components will be reduced accordingly

[0003] The drivers in the prior art are mostly used in the normal temperature environment, and the electronic components often face the working state of excessive self-heating, and the prior art only proposes a solution for this research on the heat dissipation between the electronic components, but this driver Although the electronic components on the circuit board are at a lower ambient temperature, although it is good for heat dissipation, when the operating temperature of some electronic components is lower than the rated temperature, the existing driver cannot be adjusted and controlled, which will also affect the working efficiency of the electronic components of the driver.

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