Hardware equipment case for software development

Abstract

The invention relates to the technical field of hardware equipment, and discloses a hardware equipment case for software development, which comprises an equipment case body, a heat dissipation moduleassembly is arranged in the equipment case body, a heat exchange copper pipe is fixedly mounted on the front surface of the heat dissipation module assembly, and square and round two-way connectors are fixedly communicated with the left and right end ports of the heat exchange copper pipe. The inner ends of the two square and round two-way connectors are fixedly communicated with the port of the heat exchange copper pipe, the inner end of the square and round two-way connector on the left side is fixedly communicated with a first round pipe, and a heat dissipation cylinder is arranged above the top end of the first round pipe. According to the hardware equipment case for software development, the inner cavity environment in the heat dissipation cylinder is isolated from the inner cavity environment of the equipment case, and a fan and the heat exchange copper pipe are arranged in the heat dissipation cylinder, so that dust is effectively isolated from the interior of the equipment casebody, and a hardware circuit in the equipment case body is protected from being influenced by the dust; and the service life of equipment hardware is prolonged.

Description

technical field [0001] The invention relates to the technical field of hardware equipment, in particular to a hardware equipment chassis for software development. Background technique [0002] Hardware is the abbreviation of computer hardware, which refers to the general term of various physical devices composed of electronic, mechanical and photoelectric components in the computer system. These physical devices form an organic whole according to the requirements of the system structure to provide the material basis for the operation of computer software. [0003] The existing hardware assembly chassis does not adopt any isolation measures between the internal hardware and the heat dissipation module, and even the current more advanced water cooling heat dissipation method needs to use the fan to exchange heat for the heat dissipation copper tube. It is inevitable that dust and other impurities will be brought into the inside of the chassis, which will cause dust accumulatio...

AI Technical Summary

Problems solved by technology

[0003] The existing hardware assembly chassis does not adopt any isolation measures between the internal hardware and the heat dissipation module, and even the current more advanced water cooling heat dissipation method needs to use the fan to exchange heat for the heat dissipation copper tube. It is inevitable that dust and other impurities will be brought into the inside of the chassis, which will cause dust accumulation inside the chassis, and the dust will also be brought to various hardware circuits, which may cause short circuits and other consequences, seriously reducing the service life of the equipment

[0004] Moreover, the heat dissipation efficiency of the existing water-cooled heat-exchanging copper tubes is relatively low. The present invention proposes a new pipeline structure to improve the heat-exchanging efficiency

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