Defect mode analysis method based on bad Map graph
A defect mode and analysis method technology, applied in the field of defect mode analysis based on bad maps, can solve problems such as bad maps, easy omission of certain factors, and difficulty in finding real defect modes of various types, etc., to achieve fast and effective analysis results
Pending Publication Date: 2021-01-05
上海喆塔信息科技有限公司
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[0010] This invention provides a defect pattern analysis method based on bad Maps, the purpose of which is to solve the technical problems of low efficiency, easy omission of some factors, and difficulty in finding the real defect patterns in the existing methods, and to quickly and accurately find Technical Effects of Complex Defect Types
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[0036] In order to more clearly illustrate the above-mentioned purpose, characteristics and advantages of the invention, the invention will be further elaborated below in conjunction with the accompanying drawings and specific implementation methods. The details that follow are set forth in order to more fully understand the invention. This invention can also use other additional methods not included in this description, so the scope of protection of the invention is not limited by the specific embodiments disclosed below.
[0037] refer to figure 1 , this invention proposes a defect pattern analysis method based on a bad map. For a certain product type, the defect measurement results of the same product from different sources and the measurement values of various characteristics of the product are organized according to a certain standard into a display panel Coordinate data information associated with map coordinates. Taking the defective coordinate position information...
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The invention discloses a defect mode analysis method based on a bad Map graph, and relates to the technical field of intelligent manufacturing and artificial intelligence. The method based on DBSCANdensity clustering is constructed by classifying and analyzing the badness of a display panel, the badness information is quickly positioned into the badness type, and the technical problems that theefficiency is low, some factors are easy to miss and multiple types of real defect modes are difficult to find in the existing mode are solved. The technical effect of finding out complex defect typescan be rapidly and accurately achieved. Meanwhile, the problem that an existing division method is low in speed and precision and inconvenient for big data analysis is solved, and the method is moresuitable for big data calculation and automatic analysis, high in precision and high in speed and is an efficient and accurate automatic defect classification method.
Description
technical field [0001] This invention relates to the fields of intelligent manufacturing and artificial intelligence, specifically a defect pattern analysis method based on a bad map. Background technique [0002] With the integration and development of big data and industry, and the advent of Industry 4.0, industrial big data technology, machine learning, and deep learning have become key factors to improve manufacturing productivity, competitiveness, and innovation capabilities, and accelerate products, production processes, management, services, and The intelligence of the new business model supports the transformation of China's manufacturing industry, and the construction of an open, shared, and collaborative intelligent system has become an important foundation for the manufacturing ecology. [0003] During the production process, there will be various fluctuations in terms of people, machines, materials, methods, and the environment; the market and supply chain will c...
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Login to View More IPC IPC(8): G06T7/00G06K9/62
CPCG06T7/0004G06T2207/30108G06F18/2321G06F18/22G06F18/25G06F18/24
Inventor 谢箭赵文政刘林平
Owner 上海喆塔信息科技有限公司