A multi-layer board with v_cut depth detection by electrical test

A deep detection, multi-layer board technology, applied in the direction of circuit inspection/identification, printed circuit, electrical components, etc., can solve the problems of increased rework rate, inability to divide the board, increase the workload of workers, etc., achieve accurate V_CUT depth control, avoid The trouble of line width and spacing detection, the effect of avoiding production rework or scrapping

Active Publication Date: 2021-11-12
深圳市强达电路股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, on the one hand, the probability of missed detection and false detection is high, and on the other hand, the rework rate due to missed detection and false detection will also increase, which will greatly increase the workload of workers and reduce the circuit board The production efficiency also leads to the inability to guarantee the quality of the circuit board; there is also the inability to accurately judge the operation quality of the V_CUT, the deep V_CUT causes the board to be easily broken, the V_CUT is shallow and the board cannot be separated, and rework after the components are placed causes the cost to rise , and the scrap rate has increased significantly

Method used

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  • A multi-layer board with v_cut depth detection by electrical test
  • A multi-layer board with v_cut depth detection by electrical test
  • A multi-layer board with v_cut depth detection by electrical test

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] For a four-layer multilayer board, the thickness of the board is required to be 2.0mm. In order to ensure the interlayer thickness, the thickness of the core board is required to contain a copper core board of 0.5mm. According to the requirements of the V-CUT sub-board, the V_CUT excess thickness should be controlled at 0.5-0.7mm, to ensure that the board can be accurately divided and the board is not easy to break. Therefore, according to the requirements, the board thickness is 2.0mm, and the thickness of the finished board after lamination should be controlled within the range of 1.9mm+ / 10%mm. Therefore, it is necessary to use a multi-layer core board or a multi-layer PP sheet laminate structure.

[0034] Add test terminals 2 and terminal connection lines 3 on the outer layer of the multilayer board to ensure that the electrical test can accurately confirm whether V_CUT is leaking. In the laminated structure, at 0.6+ / -0.1mm of the laminated layer Copper foil is place...

Embodiment 2

[0038] refer to image 3 , for a multi-layer board with more than six layers, the number of core boards and PP sheets is large, and there are many types of laminated structure adjustments. Taking the eight-layer board thickness requirement of 2.0mm as an example, according to the requirements, the board thickness is 2.0mm. After pressing, the thickness of the finished board should be controlled within the range of 1.9mm+ / 10%mm. According to the requirements of V-CUT board splitting, the V_CUT excess thickness should be controlled at 0.5-0.7mm to ensure accurate board splitting and not easy to break the board.

[0039] The eight-layer board needs three core boards and at least three PP sheets at the same time, which provides a variety of laminated structures. In order to ensure the thickness between layers, the thickness of the middle core board 8 is controlled according to the copper content of 0.4mm, and the remaining two The core boards are controlled at 0.3mm respectively, ...

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Abstract

The invention provides a multi-layer board for V_CUT depth detection through electrical testing, the multi-layer board includes test terminals, terminal connection wires, V_CUT depth test lines and etching factor test lines, the outer layer of the SET delivery unit Test terminals are provided on the circuit, and terminal connection lines are provided between the test terminals. In the inner circuit of the SET delivery unit, a V_CUT depth test line is provided, and the V_CUT depth test line is connected to the UNIT unit. network connection online. For multi-layer boards, the present invention can realize accurate V_CUT depth control and realize V_CUT test at the same time, avoiding production rework or scrapping due to V_CUT leakage; reducing the trouble of manual detection and improving production efficiency; avoiding V_CUT being too deep or too shallow , resulting in broken boards or inability to separate boards; it can effectively detect the etching parameters of the etching circuit, avoiding the trouble of separate line width and spacing detection.

Description

technical field [0001] The invention relates to a production detection of a multilayer circuit board, in particular to a multilayer board for V_CUT depth detection through electrical testing. Background technique [0002] The circuit board can be called a printed circuit board or a printed circuit board, which makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical layout. With the globalization and miniaturization of production, circuit boards are also developing in the direction of multi-layer and high density. At the same time, high requirements for reducing power consumption are also put forward. Control has also become a key link to reduce scrap and improve quality; after the circuit board is formed, the manufacturer needs to cut the dividing lines with a rotary cutter at a specific position on the circuit board in advance according to the customer's drawing requirements, that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0268H05K3/0052
Inventor 郭先锋祝小华
Owner 深圳市强达电路股份有限公司
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