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Crystalline silicon photovoltaic module packaging process

A photovoltaic module packaging and crystalline silicon technology, which is applied in photovoltaic power generation, semiconductor devices, electrical components, etc., can solve the problems of increasing fragments, reducing the utilization rate of photovoltaic modules, and being unable to peel off each other

Pending Publication Date: 2021-01-08
阜宁协鑫集成科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing photovoltaic modules include sequentially stacked back sheets, EVA, battery sheets, EVA and glass, which are laminated and bonded together at high temperature by a laminator to form the photovoltaic module. Two layers of EVA materials and one layer of backing are required. Plate and a piece of glass also need to use multiple tin-plated solder strips, the amount of material used is large, and its production cost is high; at the same time, fragments will be further increased during the pressurization process; in addition, due to the There is a layer of melted EVA between them, which reduces the light transmittance of the photovoltaic module to a certain extent, thereby reducing its output power; in addition, EVA is used in the photovoltaic module to bond the cells, backplane and glass into one, making The three cannot be separated from each other, so the scrapped photovoltaic modules are a kind of garbage that cannot be recycled, which reduces the utilization rate of photovoltaic modules

Method used

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  • Crystalline silicon photovoltaic module packaging process
  • Crystalline silicon photovoltaic module packaging process
  • Crystalline silicon photovoltaic module packaging process

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Embodiment Construction

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0028] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element...

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Abstract

The invention discloses a crystalline silicon photovoltaic module packaging process, which comprises the following steps of: bending a plurality of obtained copper strips according to a set shape, andadhering a plurality of battery pieces to the copper strips; then placing and laminating the obtained first tempered glass, the multiple matrixes, the rubber plate and the second tempered glass sequentially, performing sealing and fixing through bonding glue, then performing vacuum treatment and inert gas filling on two cavities formed by the rubber plate respectively, obtaining an intermediate after sealing, and the two cavities are sealed; and finally, filling and sealing gaps in the intermediate body by silica gel to finish packaging, so that the cost is reduced, and the utilization rate of the photovoltaic module is improved.

Description

technical field [0001] The invention relates to the technical field of photovoltaic module packaging, in particular to a crystalline silicon photovoltaic module packaging process. Background technique [0002] Existing photovoltaic modules include sequentially stacked back sheets, EVA, battery sheets, EVA and glass, which are laminated and bonded together at high temperature by a laminator to form the photovoltaic module. Two layers of EVA materials and one layer of backing are required. Plate and a piece of glass also need to use multiple tin-plated solder strips, the amount of material used is large, and its production cost is high; at the same time, fragments will be further increased during the pressurization process; in addition, due to the There is a layer of melted EVA between them, which reduces the light transmittance of the photovoltaic module to a certain extent, thereby reducing its output power; in addition, EVA is used in the photovoltaic module to bond the cel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048H01L31/18
CPCH01L31/048H01L31/0481H01L31/18Y02E10/50Y02P70/50
Inventor 程淦
Owner 阜宁协鑫集成科技有限公司