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Silicon ingot barreling equipment

A silicon ingot and barrel grinding technology, applied in grinding/polishing equipment, metal processing equipment, grinding machines, etc., can solve the problems of complex operation, high cost, and complex equipment structure.

Active Publication Date: 2021-01-15
深圳市晶迅捷科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This operation usually requires special equipment to operate, and there are currently a large number of special equipment used in this field, but most of these equipment are complex in structure, high in cost, and complicated in operation

Method used

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  • Silicon ingot barreling equipment
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Embodiment Construction

[0017] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0018] see Figure 1-Figure 3 The silicon ingot tumbling equipment shown includes a grinding part 10, a driving part 20, a pressing part 30 and a silicon ingot 40, the driving part 20 is installed on the side of the grinding part 10, and the pressing part 30 is located above the grinding part 10 , The regulation 40 is installed between the grinding part 10 and the driving part 20 .

[0019] Grinding section 10 comprises base 11, grinding stick 12, driven wheel 13, platform 14 and side plate 15, a...

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PUM

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Abstract

The invention discloses silicon ingot barreling equipment, and belongs to the technical field of chip manufacturing. The silicon ingot barreling equipment comprises a grinding part, a driving part, apressing part and a silicon ingot, wherein the driving part is mounted on the side part of the grinding part, and the pressing part is positioned above the grinding part and is specified to be mountedbetween the grinding part and the driving part. The grinding part comprises a pair of bases, a pair of grinding rollers, driven wheels, platforms and side plates, wherein the bases are provided withtwo single lugs arranged side by side, the grinding rollers are mounted between the bases, the driven wheels are mounted at the outer ends of rotating shafts of the grinding rollers, the platforms extend from the outer ends of the bases on the same sides as the driven wheels, and the side plates are mounted upwards on the inner sides of the platforms. The driving part comprises a motor and a driving wheel, wherein the motor is installed on the platform, and an output shaft of the motor is connected with the driving wheel. The pressing part comprises a pair of supports, a pressing roller, pressing columns, supporting columns, springs and nuts, wherein the supports stand on the ground, the pressing roller is installed on the supports, and the pressing roller carries out pressing operation onthe silicon ingot. The pressing columns are installed above the two ends of a rotating shaft of the pressing roller.

Description

technical field [0001] The invention belongs to the technical field of chip manufacturing, and in particular relates to silicon ingot rolling and grinding equipment. Background technique [0002] There are many links in the chip manufacturing process, one of the important steps is to slice the prepared monocrystalline silicon ingot to obtain silicon wafers, and an important step in the silicon wafer slicing is to scale the silicon ingot. The surface of the outer diameter of the crystalline silicon ingot is often uneven, and its diameter is often larger than the diameter specified by the final polished lens. It is necessary to obtain the precise diameter of the silicon ingot by outer diameter rolling. This operation usually requires special equipment to operate, and a large number of special equipment are currently used in this field, but most of these equipment are complex in structure, high in cost, and complicated in operation. Contents of the invention [0003] The pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B5/18B24B5/307B24B5/35B24B41/04B24B47/22
CPCB24B5/18B24B5/307B24B5/35B24B47/22B24B41/04
Inventor 李喜尼黄智伟黄斯哲
Owner 深圳市晶迅捷科技有限公司
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