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Diaphragm cutting and pasting mechanism of semiconductor product

A film sticking mechanism and semiconductor technology, which can be used in semiconductor/solid-state device manufacturing, metal processing, electrical components, etc., and can solve problems such as low film sticking efficiency.

Active Publication Date: 2021-01-15
苏州达亚电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

General film sticking operations need manual film sticking, which will easily lead to low film sticking efficiency

Method used

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  • Diaphragm cutting and pasting mechanism of semiconductor product
  • Diaphragm cutting and pasting mechanism of semiconductor product
  • Diaphragm cutting and pasting mechanism of semiconductor product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] see Figure 1 to Figure 5 , a film cutting and film sticking mechanism for semiconductor products, including a positioning frame 10, a traverse assembly 20, a film cutting mechanism 30 and a film mounting assembly 40, the positioning frame 10 includes a delivery positioning member 11 and an L-shaped frame 12, and the delivery positioning member 11 An internal component 100 for conveying and positioning semiconductor products. The L-shaped frame 12 protrudes from one side of the conveying positioning member 11. The traversing assembly 20 includes two beams 21, a traversing screw 23 and a rotating motor 25. Two crossbeams 21 are protrudingly arranged on the side of the conveying positioning member 11 away from the L-shaped frame 12, the traverse screw mandrel 23 is positioned between the two crossbeams 21, the shells of the rotating motor 25 are installed on the ends of the two crossbeams 21, and the rotating motor 25 The output shaft of the traversing screw rod 23 is fix...

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PUM

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Abstract

The invention relates to a diaphragm cutting and pasting mechanism of a semiconductor product. The diaphragm cutting and pasting mechanism of the semiconductor product comprises a positioning frame, atransverse moving assembly, a diaphragm cutting mechanism and a diaphragm pasting assembly, the positioning frame comprises a conveying positioning piece and an L-shaped frame, the conveying positioning piece is used for conveying and positioning internal components of the semiconductor product, the L-shaped frame is arranged at one side of the conveying positioning piece in a protruding mode, the transverse moving assembly comprises two cross beams, a transverse moving screw rod and a rotation motor, the two cross beams are arranged at the side, away from the L-shaped frame, of the conveyingpositioning piece in a protruding mode, the transverse moving screw rod is located between the two cross beams, a shell of the rotation motor is arranged at the ends of the two cross beams, and an output shaft of the rotation motor is fixedly connected with the ends of the transverse moving screw rod. The diaphragm cutting and pasting mechanism of the semiconductor product is high in pasting efficiency.

Description

technical field [0001] The invention relates to a film cutting and film sticking mechanism for semiconductor products. Background technique [0002] Semiconductors are the main components of chips. With the development of semiconductor technology, the types of products made of semiconductor components are gradually enriched, such as smart phones, telephones, televisions, DVD players, video recorders, camcorders, radios, tape recorders, and combination speakers. , CD players, computers, game consoles and mobile communication products. In the production process of internal components, middle frames or components of semiconductor products, it is necessary to attach diaphragms to perform insulation, protection or holding functions. The general film sticking operation requires manual film sticking, which easily leads to low film sticking efficiency. Contents of the invention [0003] Based on this, it is necessary to provide a film cutting and film-attaching mechanism for sem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/46H01L21/67
CPCB26D1/465H01L21/67132H01L21/67126
Inventor 马正
Owner 苏州达亚电子有限公司