Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor package structure and method for manufacturing the same

A packaging structure and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as easy oxidation of circuit layers

Pending Publication Date: 2021-01-15
ADVANCED SEMICON ENG INC
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, after the singulation process of the semiconductor package structure, the exposed circuit layer on the side surface of the semiconductor package structure is prone to oxidation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor package structure and method for manufacturing the same
  • Semiconductor package structure and method for manufacturing the same
  • Semiconductor package structure and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Common reference numbers are used throughout the drawings and detailed description to refer to the same or similar components. Embodiments of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0031] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to illustrate certain aspects of the disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first feature and the second feature are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed on the first feature. An embodiment in which a feature is f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical conductivityaaaaaaaaaa
Login to View More

Abstract

A semiconductor package structure includes a base material, at least one semiconductor chip, an encapsulant, a depression structure, a redistribution layer and at least one conductive via. The semiconductor chip is disposed on the base material. The encapsulant is disposed on the base material and covers the at least one semiconductor chip. The encapsulant has an outer side surface. The depressionstructure is disposed adjacent to and exposed from of the outer side surface the encapsulant. The redistribution layer is disposed on the encapsulant. The conductive via is disposed in the encapsulant and electrically connects the semiconductor chip and the redistribution layer.

Description

technical field [0001] The present disclosure relates to a semiconductor package structure and a manufacturing method thereof, and relates to a semiconductor package structure including a wettable side and a manufacturing method thereof. Background technique [0002] The semiconductor packaging structure has been applied in the field of automobile (auto-vehicle, ATV). In the past, semiconductor package structures had side surfaces from which the diced circuit layers were exposed. During assembly to the motherboard, the solder wicks up along the sidewalls of the circuit layers and forms a solder fillet where the quality of the joint can be detected. That is, the side surfaces of the semiconductor package structure are solder wettable flanks, which can be used for inspection to ensure the bonding quality between the semiconductor package structure and the motherboard. However, most of the side surfaces are molding compounds that prevent solder from wetting onto the side surf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/48H01L23/498H01L21/56
CPCH01L23/3121H01L23/481H01L23/49838H01L21/561H01L23/3107H01L23/367H01L23/4334H01L23/49548H01L23/13H01L23/145H01L2224/73267H01L2224/32245H01L2224/92244H01L2224/04105H01L2924/15153H01L2224/32225H01L2224/97H01L2224/18H01L24/19H01L24/20H01L2224/2101H01L2224/2105H01L24/32H01L24/83H01L2224/83H01L2924/0001H01L23/3135H01L24/73H01L24/97H01L2224/73151
Inventor 邱基综谢慧英李彗华陈证元
Owner ADVANCED SEMICON ENG INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com