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Laminated electronic component and method for manufacturing laminated electronic component

A kind of electronic components, laminated technology, applied in the direction of fixed capacitance parts, electrical components, laminated capacitors, etc., can solve problems such as structural defects of laminated bodies

Active Publication Date: 2021-01-19
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a concern that structural defects may easily occur inside the laminated body

Method used

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  • Laminated electronic component and method for manufacturing laminated electronic component
  • Laminated electronic component and method for manufacturing laminated electronic component
  • Laminated electronic component and method for manufacturing laminated electronic component

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Experimental program
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Embodiment Construction

[0015] The features of the present disclosure will be described with reference to the drawings. In addition, in the embodiments of the multilayer electronic component described below, the same reference numerals are attached to the same or common parts in the drawings, and the description thereof may not be repeated.

[0016] -Embodiments of laminated electronic components-

[0017] Regarding the multilayer ceramic capacitor 100 representing an embodiment of the multilayer electronic component according to the present disclosure, using Figure 1 ~ Figure 3 Be explained.

[0018]

[0019] figure 1 is a cross-sectional view of the multilayer ceramic capacitor 100 . The multilayer ceramic capacitor 100 includes a multilayer body 10 . The laminated body 10 includes a plurality of dielectric layers 11 and a plurality of internal electrode layers 12 that are stacked. In addition, the laminated body 10 has: a first main surface and a second main surface opposite to the laminat...

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Abstract

The invention provides a laminated electronic component and a method for manufacturing the laminated electronic component. The laminated electronic component is capable of suppressing the occurrence of structural defects in a laminated body. The stacked electronic component includes a stacked body including a plurality of stacked dielectric layers and a plurality of stacked internal electrode layers. When the ratio of the major axis of the plate-shaped object orthogonal to the thickness direction to the thickness is defined as the aspect ratio, the dielectric layer has a plurality of first crystal grains as the plate-shaped object, the first crystal grains having an average thickness of 300 nm or less and an average aspect ratio of 5 or more. The internal electrode layer has a plurality ofsecond crystal grains as plate-like objects having an average thickness of 150 nm or less and an average aspect ratio of 5 or more.

Description

technical field [0001] The present disclosure relates to a multilayer electronic component and a method of manufacturing the multilayer electronic component. Background technique [0002] In multilayer electronic components such as multilayer ceramic capacitors, improvements in capacitance due to thinner dielectric layers have been developed. In order to thin the ceramic green sheet used as the dielectric layer, it is necessary to use a fine particle dielectric powder. However, such fine-grained dielectric powder tends to agglomerate when slurried to produce ceramic green sheets, and if it is sintered without grain growth to form fine-grained dielectric crystal grains, there is a problem that the dielectric constant decreases. question. [0003] In order to solve the above-mentioned problems, JP 2008-266086 A discloses a technique of obtaining a thinned ceramic green sheet using plate-shaped barium titanate particles. [0004] A laminated body of a multilayer electronic c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12C04B35/468C04B41/88
CPCH01G4/30H01G4/1227C04B35/4682C04B41/88C04B41/51C04B41/5144H01G4/012H01G4/232H01G4/248
Inventor 笹林武久石部清志郎上野健之福盛爱鹤明大滨田大介
Owner MURATA MFG CO LTD