Method for producing laminated ceramic electronic part
A technology of electronic components and manufacturing methods, applied in the direction of multilayer capacitors, fixed capacitance parts, electrical components, etc., can solve problems such as delamination between layers and reduction in joint strength
Active Publication Date: 2008-03-05
MURATA MFG CO LTD
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Problems solved by technology
However, due to the increase in the degree of polymerization, the ceramic green sheets are not deformed when heated and pressed at the non-opposed parts of the ceramic laminate, so that the bonding strength between the superimposed ceramic green sheets is reduced, and delamination may occur.
Method used
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Embodiment Construction
[0037] Next, a method of manufacturing the laminated ceramic electronic component of the present embodiment will be described with reference to the drawings. In addition, in this embodiment, a multilayer ceramic capacitor will be described as an example of a multilayer ceramic electronic component.
[0038] FIG. 1 is a flowchart showing the manufacturing process of the multilayer ceramic capacitor of the present embodiment.
[0039] First, the BaTiO 3 The ceramic powder as the main component is mixed with a solvent and crushed, and then mixed with an organic binder composed of PVB with a polymerization degree of about 1000 and a plasticizer composed of dioctyl phthalate in a specific ratio. A resin and a solvent are mixed to prepare a ceramic slurry (s1).
[0040] Then, using a doctor blade or the like, the ceramic slurry is applied to the surface of the supporting film with a uniform thickness, and dried to form a ceramic green sheet (s2).
[0041] Here, the content (% by ...
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Abstract
The present invention relates to a method for manufacturing multilayer ceramic electronic component, which can manufacture a thin-film multi-layered type laminated ceramic electronic component having high reliability by deterring structural defects such as inter-layer peeling and a short circuit. When ceramic slurry to form a ceramic green sheet with a specified thickness through coating and drying is manufactured (s1), the content rate of resin consisting of an organic binder and a plasticizer to the ceramic slurry is set within a specified range according to the thickness of a ceramic layer formed by sintering the ceramic green sheet. Consequently, the ceramic layer has proper hardness and adhesive strength, so structural defects such as a short circuit and inter-layer peeling are deterred when the ceramic green sheet is heat pressed (s5) and a raw body is sintered (s7). Further, a ceramic sinter increases in strength, so high-temperature load life is improved.
Description
technical field [0001] The present invention relates to a method for manufacturing laminated ceramic electronic components such as laminated ceramic capacitors, and more particularly to a method for manufacturing ceramic green sheets that form ceramic layers of laminated ceramic electronic components after firing. Background technique [0002] The structure of a multilayer ceramic capacitor as a multilayer ceramic electronic component will be described with reference to the drawings. [0003] FIG. 2 is a cross-sectional view showing the structure of a multilayer ceramic capacitor. [0004] As shown in FIG. 2 , the laminated ceramic capacitor is composed of a ceramic sintered body 1 formed by alternately laminating a plurality of internal electrodes 3 a, 3 b and a plurality of ceramic layers 2 , provided at both ends of the ceramic sintered body 1 and The external electrodes 4a, 4b are connected to the internal electrodes 3a, 3b, respectively. Here, the internal electrodes ...
Claims
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IPC IPC(8): H01G4/12C04B35/622H01G4/30
CPCH01G4/12H01G4/33H03H2001/0085
Inventor 松田真中川洁
Owner MURATA MFG CO LTD