PCB substrate conveying device with leveling function and grinding machine

Abstract

The invention discloses a PCB substrate conveying device with a leveling function. A first conveying belt mechanism comprises a first conveying belt and a plurality of first compression rollers, and the first compression rollers are disposed below the first conveying belt and can enable a PCB substrate to abut against the surface of the first conveying belt; A second conveying belt mechanism comprises a second conveying belt and a plurality of second pressing rollers, the second pressing rollers are arranged above the second conveying belt and can press the PCB substrate on the surface of thesecond conveying belt, the first conveying belt mechanism and the second conveying belt mechanism are arranged front and back, and the first conveying belt and the second conveying belt are parallel to each other and distributed in an up-down staggered mode; and a leveling roller is arranged below an output end of the first conveying belt in a liftable mode and is close to an input end of the second conveying belt, and the leveling roller can adjustably press the PCB substrate against the surface of the first conveying belt. The invention discloses a grinding machine, the leveling roller can press the PCB substrate towards the first conveying belt, and bending deformation of the PCB substrate is avoided.

Description

technical field [0001] The invention relates to the field of PCB board equipment, in particular to a PCB substrate conveying device and a grinder with a leveling function. Background technique [0002] The Chinese name of PCB is printed circuit board, also known as printed circuit board, which is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. When making a PCB, it is necessary to grind the surface of the PCB substrate. For example, use a grinder to grind the upper and lower surfaces of the PCB substrate. The current grinding and conveying device includes at least two conveyor belts parallel to each other, and the two conveyor belts are at different heights. The upper and lower surfaces can contact two conveyor belts respectively. When the PCB substrate is transferred between different conveyor belts, one surface of the PCB substrate is ground first, and the upper and lower surfaces of ...

AI Technical Summary

Problems solved by technology

When making a PCB, it is necessary to grind the surface of the PCB substrate. For example, use a grinder to grind the upper and lower surfaces of the PCB substrate. The current grinding and conveying device includes at least two conveyor belts parallel to each other, and the two conveyor belts are at different heights. The upper and lower surfaces can contact two conveyor belts respectively. When the PCB substrate is transferred between different conveyor belts, one surface of the PCB substrate is ground first, and the upper and lower surfaces of the PCB substrate are subjected to unbalanced driving force, and the PCB substrate is prone to reverse bending deformation. , especially thin-walled metal plates, will form a curl, which seriously affects the transition of the PCB substrate from one conveyor to another conveyor belt. At the same time, due to the excessive curl of the PCB substrate, it is not easy to attach to the belt

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