Small-hole gravity type solder ball array method and process
A gravity type and solder ball technology, which is applied in the field of small hole gravity type solder ball arrays, can solve the problems of low production capacity and poor precision, and achieve the effects of increasing production capacity, improving processing efficiency, and increasing implantation accuracy
Inactive Publication Date: 2021-01-29
深圳市立可自动化设备有限公司
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[0003] The purpose of the present invention is to provide a small hole gravity solder ball array method and process, which is used for batch distribution of balls in the pre-automatic production of BGA packaging and solves the problems of low production capacity and poor precision
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[0027] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0028] The present invention provides such as Figure 1-4 A small hole gravity solder ball array method and process shown includes the following steps:
[0029] Step 1. Set the lower solder ball plate 3 on the operating platform 2 that can be tilted and turned over, and set the ball fetching upper plate 4 that can move left and right and up and down above the solder ball lower ball plate 3. Arrayed cup-shaped micro-holes are processed in the ball plate 4 and the solder ball lower ball plate 3, and the cup-shaped micro-holes on the ball upper plate 4 correspond to the cup-shaped micro-holes on the solder ball lower ball plate 3;
[0030] Step 2: Install a vacuum cavity support plate 5 on the bottom of the lower ball plate 3 for solder balls and t...
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The invention discloses a small-hole gravity type solder ball array method and process, and the method comprises the following steps: arranging a solder ball discharging plate on an operation platformwhich can achieve the inclination and turnover control, and arranging a ball taking and feeding plate which can move left and right and up and down above the solder ball discharging plate, processingarray type cup-shaped miniature small holes in the upper solder ball taking plate and a lower solder ball taking plate, the cup-shaped miniature small holes in the upper solder ball taking plate corresponding to the cup-shaped miniature small holes in the lower solder ball plate, and installing vacuum cavity supporting plates at the bottom of the lower solder ball plate and the top of the upper solder ball taking plate. And the vacuum cavity in a vacuum cavity support plate is communicated with the cup-shaped micro small holes in the solder ball lower ball plate and the ball taking upper ballplate. The solder ball bin is controlled to enable the solder balls to fall onto the ball discharging plate under the action of gravity and negative pressure, then the solder balls are controlled toreset and close the negative pressure of the ball discharging plate, the redundant solder balls are taken away under the dual action of gravity and a scraper, the ball taking and feeding plate is controlled to transfer the solder balls into the solder balls, and the capacity of full-automatic BGA packaging production is improved. And the implantation precision and the ball mounting efficiency of the solder balls are improved.
Description
technical field [0001] The invention relates to the technical field of chip manufacturing and packaging, in particular to a small hole gravity solder ball array method and process. Background technique [0002] With the rise of the semiconductor industry, the demand for chips is increasing. The method and process of chip manufacturing cannot keep up with the production capacity. In the packaging of chip manufacturing, a large number of solder balls will be implanted, and because the solder balls are small, And it needs to be distributed in a high-precision array, so the solder ball implantation is more complicated, and its arrangement is troublesome. In the existing chip manufacturing solder ball planting process, most of them are semi-automatic ball placement, stencil ball placement, single-point ball placement, etc. method, but it is far from meeting the production capacity requirements. There are problems of low efficiency, low production capacity, and low precision, whic...
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IPC IPC(8): H01L21/60
CPCH01L24/11H01L24/742H01L24/93H01L2224/119H01L2224/742
Inventor 叶昌隆谢交锋陈雨杰
Owner 深圳市立可自动化设备有限公司
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