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Solderability fixture for chip resistor and capacitor

A technology of resistors and capacitors, applied in the field of chip resistors and capacitor solderability fixtures, can solve the problems of uncontrollable dipping height, low efficiency, unstable fixation, etc., to improve overall stability, simple structure, The effect of saving production costs

Pending Publication Date: 2021-02-02
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing problems are: (1) the fixation is unstable and easy to slip; (2) the efficiency is not high; (3) the height of impregnation cannot be controlled

Method used

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  • Solderability fixture for chip resistor and capacitor
  • Solderability fixture for chip resistor and capacitor
  • Solderability fixture for chip resistor and capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022]Such asFigure 1-6As shown, a solderability fixture for chip resistors and capacitors includes a tin furnace 1 and symmetrically distributed lifting frames 2 are respectively provided on both sides of the tin furnace 1. The lifting frame 2 includes a base 2a, on which a screw 2b is vertically fixed and connected, and a pair of correspondingly matched nuts 2c are sleeved on the screw 2b.

[0023]A cantilever 3 is sleeved on each lifting frame 2. The cantilever 3 includes a horizontal section a, one end of the horizontal section a is fixedly connected with a vertical section b, and the other end of the horizontal section a It is threaded on the screw 2b between the two nuts 2c. The height of the cantilever 3 is adjusted by turning the nut 2c.

[0024]A scale frame 7 is placed on one side of each lifting frame 2, and the height of the cantilever 3 can be known by comparing the scale bars of the cantilever 3 and the scale frame 7, so as to ensure that the cantilevers 3 on the two lifting...

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PUM

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Abstract

The invention provides a solderability fixture for a chip resistor and a capacitor. The solderability fixture comprises a tin furnace (1) and is characterized in that lifting frames (2) are respectively arranged on two sides of the tin furnace (1), a movable cantilever (3) is arranged on each lifting frame (2), a clamping body (4) is correspondingly connected to one end of each cantilever (3), anda substrate slot (5) is clamped on each clamping body (4). A group of substrates (6) are inserted between the two substrate slots (5), and clamping grooves (6a) are formed in the two sides of each substrate (6). The solderability fixture is simple in structure and convenient to use, the dipping height is accurately controlled, the test accuracy is ensured, the working efficiency is improved, andthe production cost is saved.

Description

Technical field:[0001]The invention relates to the technical field of welding tests, in particular to a solderability fixture for chip resistors and capacitors.Background technique:[0002]The solderability test is to determine the solderability of the leads of devices that are usually soldered. Judging the solderability depends on the wetting ability of these leads when they are coated with solder, or the ability to form proper fillet welds when solder is dipped.[0003]It is clearly stipulated in the national solderability test standard that when solderability test is performed, the solderability test equipment needs to realize that the sample is impregnated with flux and solder at a specified speed and reach the specified depth.[0004]At present, there are two methods for domestically produced equipment for solderability testing. The first method is to directly use a tin furnace to control the temperature and manually conduct the immersion test; the second method is to use a screw dri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N13/00
CPCG01N13/00
Inventor 张增龙王峙卫路成萍
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE