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Method and device for reducing low-temperature power consumption of EML optical module

An optical module, low temperature technology, applied in optical transmission systems, electromagnetic wave transmission systems, electrical components, etc., can solve problems such as difficulty in low power consumption and increased module power consumption

Inactive Publication Date: 2021-02-02
LINKTEL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the TEC optical module will increase the power consumption of the module. As the difference between the ambient temperature and the set temperature of the TEC optical module increases, the output current of the TEC optical module will also increase, and the EML device is comparable to the traditional DML device. In comparison, it has a higher bias current Bias, which makes it difficult for EML's TEC optical module to achieve low power consumption under the application of operating temperature

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  • Method and device for reducing low-temperature power consumption of EML optical module
  • Method and device for reducing low-temperature power consumption of EML optical module
  • Method and device for reducing low-temperature power consumption of EML optical module

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Embodiment Construction

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. In addition, the technical features in each embodiment or a single embodiment provided by the present invention can be combined arbitrarily with each other to form a feasible technical solution. This combination is not restricted by the sequence of steps and / or structural composition mode, but it must be Based on the ability of those skilled in...

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Abstract

The embodiment of the invention provides a method and device for reducing low-temperature power consumption of an EML optical module. The method comprises the steps: cooling a standard module, and ifthe temperature of the standard module is lower than a preset threshold value, acquiring a compensation value for compensation; if the temperature of the standard module remains unchanged, reducing the low-temperature power consumption of the EML optical module. According to the method and the equipment for reducing the low-temperature power consumption of the EML optical module provided by the embodiment of the invention, the low-temperature power consumption of the EML optical module can be reduced under the condition that the temperature of the standard module is not changed.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of EML optical modules, and in particular to a method and equipment for reducing low-temperature power consumption of EML optical modules. Background technique [0002] EML (electroabsorption modulated laser) with TEC optical module has great advantages in the application of working temperature. The wavelength of EML emitted light is sensitive to temperature changes. When the ambient temperature of the optical module changes, TEC can stabilize the working temperature of the EML at the set temperature. The fixed temperature point remains unchanged, thereby ensuring that the wavelength is stable within a certain range. However, the TEC optical module will increase the power consumption of the module. As the difference between the ambient temperature and the set temperature of the TEC optical module increases, the output current of the TEC optical module will also increase, and the EML dev...

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Application Information

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IPC IPC(8): H04B10/80
CPCH04B10/806
Inventor 张佩吴天书杨现文李林科张健
Owner LINKTEL TECH CO LTD