Environment-friendly device for efficiently removing oxide film on surface of circuit board
A surface oxidation and circuit board technology, applied in printed circuits, printed circuit manufacturing, printed circuit secondary treatment, etc. The effect of heat loss, high work efficiency and high removal efficiency
Inactive Publication Date: 2021-02-02
温州法步驰信息科技发展有限公司
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Problems solved by technology
[0004] Aiming at the deficiencies of the existing technology, the invention provides an environmentally friendly device for efficiently removing the oxide film on the surface of the circuit board, which has the advantages of efficiently removing the oxide film on the surface of the circuit board without causing wear to the circuit board and high work efficiency, and solves the problem of Fine sandpaper is easy to wear the circuit board while grinding the oxide layer, and the work load of fine sandpaper to remove the oxide film is relatively large, and the work efficiency is low
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[0026] The technical solutions in the embodiments of the invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the invention. Obviously, the described embodiments are only part of the embodiments of the invention, not all of them. Based on the embodiments of the invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the invention.
[0027] see Figure 1-6 , an environment-friendly device for efficiently removing oxide films on the surface of circuit boards, comprising a device main body 100, a threaded post 200 is provided at the bottom of the device main body 100, a rotating bearing is provided outside the upper end of the threaded post 200, and a sliding bearing is provided outside the threaded sleeve 201 track, turning the threaded column 200 will drive the threaded sleeve 201 to move up and down, thereby driving...
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The invention relates to the technical field of circuit board surface treatment, and discloses an environment-friendly device for efficiently removing an oxide film on the surface of a circuit board.The device comprises a driving wheel, wherein a rotating part is fixedly arranged in front of the driving wheel, a sliding groove part is movably connected with the front surface of the rotating part,a sliding block is movably connected to the upper part of the sliding groove part, a cleaning agent bag is arranged above the movable plate, a spraying device is fixedly connected to the toothed plate, and a first spring is fixedly installed on the spraying device. According to the environment-friendly device, the driving wheel drives the rotating part to rotate, the sliding groove part drives amoving rod to move through the sliding block, the moving plate moves upwards to extrude the cleaning agent bag, a cleaning agent in the cleaning agent bag is sprayed to a circuit board through the spraying device, and the toothed plate drives the spraying device to extrude the first spring to move outwards; and therefore, the cleaning agent is uniformly sprayed on the upper surface of the circuitboard, an oxide film on the surface of the circuit board is completely contacted with the cleaning agent, and the effect of efficiently removing the oxide film on the surface of the circuit board is achieved.
Description
technical field [0001] The invention relates to the technical field of surface treatment of circuit boards, in particular to an environment-friendly device for efficiently removing oxide films on the surface of circuit boards. Background technique [0002] The circuit board is an important part of electronic products, and the circuit board is also the place where electronic products are most likely to fail, so the processing of the circuit board needs to be more rigorous and careful. The surface of the circuit board often forms an oxide film before processing. When printing circuit boards, the toner on the thermal transfer paper can be firmly printed on the copper clad laminate, and the oxide film needs to be removed. At present, fine sandpaper is generally used to polish off the oxide layer on the surface of the copper clad laminate. There are many problems in this treatment method. : Fine sandpaper is very easy to wear the circuit board while grinding the oxide layer, resu...
Claims
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IPC IPC(8): H05K3/26C23G1/10
CPCC23G1/103H05K3/26H05K2203/0789
Inventor 张酒铭
Owner 温州法步驰信息科技发展有限公司