Heat dissipation device and electronic equipment
A technology for heat dissipation devices and heat dissipation blades, which is applied to structural components of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc. It can solve the problems of short service life of fans and achieve improved convective heat transfer coefficient, small mass and high efficiency The effect of heat dissipation
Active Publication Date: 2021-02-09
HANGZHOU HIKVISION DIGITAL TECH
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Problems solved by technology
However, this traditional fan has a short service life due to the limitation of mechanical components such as bearings.
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[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0026] figure 1 The structure of the heat sink 1 according to one embodiment of the present invention is schematically shown. Such as figure 1 As shown, the heat dissipation device 1 includes a heat conduction block 100 and heat dissipation fins 200 installed on the heat conduction block 100 . The first end 201 of the cooling fin 200 is a mounting ...
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The invention discloses a heat dissipation device and electronic equipment. The heat dissipation device comprises a heat conduction block, heat dissipation blades and inverse piezoelectric elastic pieces installed at the first ends of the heat dissipation blades, wherein the first ends of the heat dissipation blades are installation ends, and the second ends of the heat dissipation blades are freeends. The roots of the first ends of the heat dissipation blades and the roots of the inverse piezoelectric elastic pieces are fixedly installed on the heat conduction block, so that the heat dissipation blades can vibrate under driving of the inverse piezoelectric elastic pieces. According to the heat dissipation device, the inverse piezoelectric elastic pieces are used for driving the heat dissipation blades to vibrate at high frequency, and the convective heat transfer coefficient is increased, so that efficient heat dissipation is achieved; and the heat dissipation device does not comprise mechanical components such as bearings, and therefore, the service life is long.
Description
technical field [0001] The present application relates to the field of electronic components, in particular to a heat dissipation device. The present application also relates to electronic equipment comprising such a heat sink. Background technique [0002] Electronic equipment generates heat during use, which leads to performance degradation of the electronic equipment. Therefore, it is necessary to dissipate heat for the electronic equipment. For example, conventional motor-driven blade-turning fans can be used to force-air cool electronic equipment. However, this traditional fan has a short service life due to the limitation of mechanical components such as bearings. Contents of the invention [0003] In order to solve the above problems, the present invention proposes a heat dissipation device. The heat dissipation device of the present invention uses an inverse piezoelectric elastic sheet to drive the heat dissipation blades to vibrate at high frequency, thereby im...
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IPC IPC(8): H05K7/20
CPCH05K7/20136Y02D10/00F04D33/00
Inventor 杨丛富
Owner HANGZHOU HIKVISION DIGITAL TECH