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Pin correction device for metal packaging thick film integrated circuit

A technology for calibrating devices and integrated circuits, which is applied in the field of metal-packaged thick-film integrated circuits, can solve the problems of glass insulator damage, product airtightness failure, product elimination, glass insulator damage, etc., and achieves convenient use and improved airtightness. And the effect of quality reliability and simple structure

Pending Publication Date: 2021-02-23
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] At present, during the processing and testing process of such a metal shell package circuit, the gold metal lead post of the product is induced by external force to cause deformation. In order to ensure the assembly requirements of the circuit, the lead leg of the product needs to be calibrated. Products with broken airtightness of connected glass insulators are eliminated
[0005] At present, we use manual and simple tooling for shaping, which will cause damage to the glass insulator after shaping, and the reliability of the airtightness of the product cannot be achieved. Therefore, it is necessary to design a non-destructive correction device for the lead legs

Method used

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  • Pin correction device for metal packaging thick film integrated circuit
  • Pin correction device for metal packaging thick film integrated circuit
  • Pin correction device for metal packaging thick film integrated circuit

Examples

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Embodiment Construction

[0020]Such asFigure 1-5As shown, a metal-encapsulated thick film integrated circuit lead correction device includes a rectangular base 1 with a round table 2 at one end of the base 1, and a round table 2 corresponding to the thick film integrated circuit to be corrected. Mating installation slot 2a.

[0021]A ring groove 3 is also provided on the base 1 outside the round table 2, and a first correction device 4 with sliding fit is provided in the ring groove 3. The illustrated first correction device 4 includes a corresponding mating sliding block 4a provided in the ring groove 3. Vertically distributed uprights 4b are connected to the sliding block 4a, and the sliding blocks 4a on both sides of the upright 4b are respectively provided with a locking screw 4c corresponding to the groove bottom of the ring groove 3.

[0022]A first sliding sleeve 4d and a second sliding sleeve 4e are sequentially sleeved on the upright 4b, and correspondingly matched first locking nails 4m and second locki...

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Abstract

The invention provides a pin correction device for metal packaging thick film integrated circuit. The pin correction device comprises a base (1) and is characterized in that a circular truncated cone(2) is arranged on the base (1), a mounting groove (2a) is formed in the circular truncated cone (2), an annular groove (3) is formed in the base (1) on the outer side of the circular truncated cone (2), a first correction device (4) in sliding fit is arranged in the circular truncated cone (2), a groove (5) is formed in one side of the annular groove (3), and the groove (5) is provided with a second correcting device (6) in sliding fit. The device is simple in structure and convenient to use, controllable metal lead column lossless correction is achieved, and the air tightness and quality reliability of products are improved.

Description

Technical field:[0001]The invention relates to the technical field of metal package thick film integrated circuit technology, in particular to a metal package thick film integrated circuit lead correction device.Background technique:[0002]Thick-film integration technology is mostly used in the processing of high-reliability, high-precision, and high-value products, and the product requires a high price for its packaging. Most of its current use is a metal shell full airtight packaging to improve sealing reliability.[0003]The metal shell structure is divided into a metal shell, a glass insulator and a metal lead post, and the metal shell, glass insulator and metal lead post are integrated by high temperature sintering to ensure reliable tightness packaging.[0004]At present, in the process of processing and testing of the metal shell encapsulated circuit, the product gold metal lead post is deformed by the external force caused by the external force. In order to ensure the assembly re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21F1/02
CPCB21F1/02
Inventor 尹宏程贾铃宇杨宝平崔翔韩泽辉
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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