Loudspeaker module and electronic equipment
A loudspeaker module and sound hole technology, applied in the direction of sensors, electrical components, etc., can solve the problems of unfavorable speaker acoustic performance, reduced service life of internal components, poor heat dissipation of speakers, etc., to achieve simple molding methods, improve performance, A more textured appearance
Active Publication Date: 2021-02-23
GOERTEK INC
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Problems solved by technology
With the increase of user demand, the performance of the speaker needs to be enhanced accordingly. However, the thickness of the speaker shell made of plastic parts is relatively large, which makes the shell occupy a large space in the acoustic cavity, which is not conducive to the acoustic performance of the speaker. The casing made of components is not conducive to the heat dissipation of the speaker, and the poor heat dissipation of the speaker will reduce the service life of the internal components
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0034] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
[0035] In addition, the ...
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The invention discloses a loudspeaker module and electronic equipment, and the loudspeaker module comprises a housing made of a metal material, wherein the housing is provided with an accommodation cavity, and the side of the housing is provided with a sound hole; and a middle shell made of metal materials and a sound production single body, wherein the middle shell is of an annular structure, aninstallation port is formed in the upper side of the middle shell, the sound production single body is connected to the installation port of the middle shell in a sealed mode, the sound production single body and the middle shell are both contained in the accommodation cavity and divide the accommodation cavity into a front sound cavity and a rear sound cavity, an opening is formed in the side, close to the sound outlet hole, of the middle shell, and the front sound cavity is communicated with the sound outlet hole through the opening. According to the technical scheme, the heat dissipation efficiency of the loudspeaker module can be improved.
Description
technical field [0001] The invention relates to the technical field of electroacoustic products, in particular to a loudspeaker module and electronic equipment. Background technique [0002] As an indispensable and important component in electronic products, speakers play an important role in the overall performance of electronic equipment. With the increase of user demand, the performance of the speaker needs to be enhanced accordingly. However, the thickness of the speaker shell made of plastic parts is relatively large, which makes the shell occupy a large space in the acoustic cavity, which is not conducive to the acoustic performance of the speaker. The casing made of components is not conducive to the heat dissipation of the speaker, and the poor heat dissipation of the speaker will reduce the service life of the internal components. Contents of the invention [0003] The main purpose of the present invention is to provide a speaker module, aiming at improving the h...
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IPC IPC(8): H04R9/02H04R9/06
CPCH04R9/022H04R9/06
Inventor 李兆鹏陈国强
Owner GOERTEK INC