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Injection molding equipment with injection molding heat preservation structure for electronic part machining

A technology of injection molding equipment and spare parts, which is applied in the field of injection molding equipment with injection molding heat preservation structure for electronic parts processing, which can solve the problems of inconvenient demoulding treatment of injection molded parts, inconvenient guidance and protection of injection molded parts, inconvenient use, etc., and achieve good heat preservation effect , reduce limitations, and reduce safety hazards

Inactive Publication Date: 2021-02-26
深圳市辉迪机电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an injection molding equipment with an injection molding heat preservation structure for electronic parts processing, so as to solve the problem that the electronic parts injection molding equipment proposed in the above background technology is inconvenient for users to demould the injection molded parts after injection molding. Handling, as well as the problem of easy access after demoulding, brings inconvenience to the user, and it is inconvenient for the user to guide and protect the injection molded parts during the transmission process during use

Method used

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  • Injection molding equipment with injection molding heat preservation structure for electronic part machining
  • Injection molding equipment with injection molding heat preservation structure for electronic part machining
  • Injection molding equipment with injection molding heat preservation structure for electronic part machining

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Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on The embodiments of the present invention and all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer" , "front end", "rear end", "head", "tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the desc...

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Abstract

The invention discloses injection molding equipment with an injection molding heat preservation structure for electronic part machining, and relates to the technical field of electronic part injectionmolding machining. The injection molding equipment comprises an injection molding part and an adjusting device, wherein a conveying belt is arranged outside the injection molding part, supporting columns are installed at the two ends of the exterior of the bottom of the conveying belt correspondingly, a guiding device is arranged at one end of the outer portion of one supporting column, a storageframe is installed on the outer portion of the bottom of the guiding device, and a pushing device is arranged at the bottom of the interior of the storage frame. By arranging the adjusting device, the vertical height of a first hydraulic air rod, a placement bottom plate and the adjusting device can be adjusted by arranging a second hydraulic air rod, the distance adjustment and injection moldingtreatment can be performed on an upper plate and a lower plate, after injection molding is finished, the lower plate can be pushed under the action of the first hydraulic air rod, and therefore the injection molding part obtained after injection molding can be separated from the adjusting device, and convenience is provided for subsequent taking of the injection molding part.

Description

technical field [0001] The invention relates to the technical field of injection molding processing of electronic spare parts, in particular to an injection molding equipment with an injection molding heat preservation structure for processing electronic spare parts. Background technique [0002] Electronic spare parts are necessary components for the assembly of some electronic equipment, and many processing processes are carried out during the processing of electronic spare parts, such as injection molding of electronic spare parts to assist in the molding of electronic spare parts. [0003] The electronic component injection molding equipment on the market is inconvenient for users to demould the injection molded parts after injection molding, and the problem of easy access after demoulding is completed, which brings inconvenience to users, and in The disadvantage that it is inconvenient for the user to guide and protect the injection molded parts during the transmission ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/18B29C45/74B29C45/40B29C45/17B29C45/03
CPCB29C45/03B29C45/17B29C45/1769B29C45/18B29C45/40B29C45/74B29C2045/177
Inventor 陈其志潘锐鸿李成
Owner 深圳市辉迪机电科技有限公司
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