Process chamber in semiconductor process equipment and semiconductor process equipment

Abstract

The invention provides a process chamber in semiconductor process equipment and the semiconductor process equipment. The process chamber comprises a chamber body and a chamber cover, the chamber coveris used for sealing the chamber body, the chamber cover comprises a cover body assembly and a supporting assembly, the cover body assembly is rotatably connected with the chamber body, and the coverbody assembly can ascend and descend relative to the chamber body. The supporting assembly is connected with the cover body assembly and used for supporting the cover body assembly in the process thatthe cover body assembly rotates towards the chamber body, preventing the cover body assembly from making contact with the chamber body, enabling a gap to exist between the cover body assembly and thechamber body and stopping supporting of the cover body assembly after the two opposite faces of the cover body assembly and the chamber body are parallel so as to enable the cover body assembly to make contact with the chamber body. According to the process chamber in the semiconductor process equipment and the semiconductor process equipment, wear of a sealing component can be avoided, and therefore the service life of the sealing component is prolonged, the maintenance period is prolonged, and the chamber cover can be conveniently closed.

Description

technical field [0001] The present invention relates to the technical field of semiconductor equipment, in particular to a process chamber in semiconductor process equipment and semiconductor process equipment. Background technique [0002] Currently, the tungsten plug (W-plug) process is usually carried out by atomic layer deposition (ALD for short) or chemical vapor deposition (CVD for short). [0003] Such as figure 1 As shown, the process chamber used by these two processes generally includes a chamber body 11 and a chamber cover 12, and the chamber body 11 is provided with, for example, a carrier part (not shown) for carrying a wafer (Wafer) etc. Kits for the process, the chamber cover 12 is provided with an air inlet part (not shown in the figure) for supplying the process gas. Such as figure 1 As shown, the chamber body 11 is provided with a rotating shaft seat 13, a sealing ring 14 and a positioning pin hole 15, and the chamber cover 12 is provided with a rotating...

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Problems solved by technology

[0004] However, if figure 2 and image 3 As shown, during the closing process of the chamber cover 12, since the sealing ring 14 protrudes relative to the surface of the chamber body 11 facing the chamber cover 12, the side of the chamber cover 12 facing the chamber body 11 will first contact with the chamber body 11. The sealing ring 14 is in contact, and when the chamber cover 12 continues to rotate, the side of the chamber cover 12 facing the chamber body 11 will have sliding friction with the sealing ring 14, causing the sealing ring 14 to wear and tear, resulting in a reduction in the life of the sealing ring 14. Reduce the maintenance cycle, and if the weight of the chamber cover 12 is relatively light, the friction between the sealing ring 14 and the chamber cover 12 will also cause the chamber cover 12 to be lifted by the sealing ring 14, which will not be able to seal smoothly. It is necessary to manually press the chamber cover 12 to completely close the chamber cover 12, which is inconvenient to close the chamber cover 12

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