Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same

A glass fiber and epoxy resin technology, applied in synthetic resin layered products, glass/slag layered products, coatings, etc., can solve the problems of large dielectric loss, slow transmission rate, low stability, etc. Small electrical loss, improved stability, and small thickness

Pending Publication Date: 2021-03-02
NANTONG RODA ELECTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad laminate produced therefrom, which have low dielectric loss, fast transmission rate, and high transmission stability, so as to solve the problem of high-frequency Copper clad laminates have large dielectric loss, slow transmission rate and low stability

Method used

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  • Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same
  • Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same
  • Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same

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Effect test

Embodiment 1

[0040] Embodiment 1: The epoxy resin and glass fiber composite material composition proposed by the present invention and the high-frequency copper-clad laminate manufactured therewith, the preparation process of the high-frequency copper-clad laminate is as follows:

[0041] Step 1: Epoxy resin emulsion and glass fiber composite material are mixed to form a composition, and stirred evenly with a conventional stirring rod;

[0042] The second step: using the above composition and 0.042mm electronic grade glass cloth to prepare a rubber-impregnated sheet with a thickness of 0.08mm and a dielectric constant of 6.2;

[0043] Step 3: The above composition and copper foil are sequentially dried, baked, and sintered. The sintering temperature is controlled between 320-360 degrees Celsius, and the baking time is controlled within 10-20 minutes;

[0044] Step 4: Laminate the ready-to-use copper foil and dipped cloth into a high-frequency copper clad laminate in the form of copper foil...

Embodiment 2

[0045] Embodiment 2: The epoxy resin and glass fiber composite material composition proposed by the present invention and the high-frequency copper-clad laminate manufactured therewith, the preparation process of the high-frequency copper-clad laminate is as follows:

[0046] Step 1: Epoxy resin emulsion and glass fiber composite material are mixed to form a composition, and stirred evenly with a conventional stirring rod;

[0047] The second step: using the above composition and 0.046mm electronic grade glass cloth to prepare a rubber-impregnated sheet with a thickness of 0.08mm and a dielectric constant of 6.2;

[0048] Step 3: The above composition and copper foil are sequentially dried, baked, and sintered. The sintering temperature is controlled between 320-360 degrees Celsius, and the baking time is controlled within 10-20 minutes;

[0049] Step 4: Laminate the ready-to-use copper foil and dipped cloth into a high-frequency copper-clad laminate according to the method of...

Embodiment 3

[0050] Embodiment 3: The epoxy resin and glass fiber composite material composition proposed by the present invention and the high-frequency copper-clad laminate manufactured therewith, the preparation process of the high-frequency copper-clad laminate is as follows:

[0051] Step 1: Epoxy resin emulsion and glass fiber composite material are mixed to make a composition, and stirred evenly by means of an ultrasonic oscillator and a conventional stirring rod;

[0052]The second step: using the above composition and 0.042mm electronic grade glass cloth to prepare a rubber-impregnated sheet with a thickness of 0.08mm and a dielectric constant of 6.2;

[0053] Step 3: The above composition and copper foil are sequentially dried, baked, and sintered. The sintering temperature is controlled between 320-360 degrees Celsius, and the baking time is controlled within 10-20 minutes;

[0054] Step 4: Laminate the ready-to-use copper foil and dipped cloth into a high-frequency copper-clad ...

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Abstract

The invention discloses an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same. The method comprises the following steps: S101, preparing epoxy resin, a glass fiber composite material, copper foil and electronic-grade glass cloth; S102, mixing the epoxy resin emulsion; S103, performing combination and selection of glass fiber composite materials; and S104, mixing the epoxy resin emulsion with the glass fiber composite material to obtain the epoxy resin composition. According to the epoxy resin and glass fiber composite material composition and the high-frequency copper-clad plate manufactured by the epoxy resin and glass fiber composite material composition, the composition is prepared by uniformly stirring in a mannerof matching an ultrasonic oscillator with a conventional stirring rod, the mixing degree is higher, and the high-frequency copper-clad plate manufactured by using the composition with the higher mixing degree is high in quantity concentration and low in dielectric loss, and the transmission stability is improved; by controlling the laminating pressure to be about 12MPa, the manufactured high-frequency copper-clad plate is small in thickness, and the highest in transmission rate.

Description

technical field [0001] The invention relates to the technical field of high-frequency copper-clad laminates, in particular to an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad laminate produced therefrom. Background technique [0002] Epoxy resin refers to the general term for a class of polymers containing more than two epoxy groups in the molecule. It is the polycondensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, a variety of compounds containing active hydrogen can be used to open the ring, cure and cross-link to form a network structure, so it is a thermosetting resin; the glass fiber composite material is light and hard, non-conductive, and has excellent performance. Stable and high mechanical strength; based on the advantages of epoxy resin and glass fiber composite materials, combined with epoxy resin and glass fiber composite materials, copper foil and electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/14C08J3/205B32B17/04B32B17/06B32B15/20B32B27/04B32B27/38
CPCC08K7/14C08J3/205B32B5/02B32B15/14B32B15/20C08J2363/00B32B2250/40B32B2255/06B32B2255/26B32B2260/021B32B2260/046B32B2262/101B32B2262/10B32B2307/20C08L63/00
Inventor 包晓剑顾鑫
Owner NANTONG RODA ELECTRON
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