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Sensor and integrated circuit module

A technology of integrated circuits and sensors, applied in circuits, measuring instrument components, instruments, etc., can solve problems such as high cost, inability to reduce cost, and complexity of manufacturing process

Pending Publication Date: 2021-03-05
NUVOTON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the outer layer of the integrated circuit chip is directly exposed and exposed to the surrounding environment, it is difficult to avoid and eliminate component failures caused by environmental factors in the future.
Furthermore, the cost of special packaging is always higher than that of traditional standard packaging and the manufacturing process complexity is high, and because there is no other solution, the cost of this type of sensor cannot be reduced

Method used

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  • Sensor and integrated circuit module
  • Sensor and integrated circuit module
  • Sensor and integrated circuit module

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Embodiment Construction

[0072] In order to make the objects, features, and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with accompanying drawings. Wherein, the arrangement of each element in the embodiment is for the purpose of illustration, and is not intended to limit the present invention. In addition, part of the symbols in the figures in the embodiments are repeated for the purpose of simplifying the description, and do not imply the relationship between different embodiments. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only directions referring to the attached drawings. Accordingly, the directional terms are used to illustrate and not to limit the invention.

[0073] It must be understood that elements not specifically described or illustrated may exist in various forms well known to those skilled in the art. In addition, when a certain layer is "o...

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Abstract

The invention provides a sensor and an integrated circuit module. The sensor is disposed on a package body of an integrated circuit chip. The sensor includes a sensing element, a protective element, acover, and at least two traces. The sensing element is disposed on the integrated circuit chip. The protective element is disposed on the integrated circuit chip and surrounds the sensing element. The cover is connected to the protective element. The at least two traces are electrically connected to the sensing element and to at least two pins of the integrated circuit chip.

Description

technical field [0001] The invention relates to a sensor and an integrated circuit module, in particular to a sensor which can be plugged into an integrated circuit chip. Background technique [0002] With the development of technology, many electronic devices (such as tablet computers or smart phones) are equipped with one or more sensors configured to sense various environmental information, such as temperature, humidity, airflow and so on. [0003] When it is necessary to detect the environment, the sensor with the environment sensing function needs to be in direct contact with the surrounding environment, so most of them need to rely on customized special packaging to achieve. Through a special packaging method, the integrated circuit chip is opened to the outside world in order to achieve the purpose of sensing. However, if the outer layer of the integrated circuit chip is directly exposed and exposed to the surrounding environment, it is difficult to avoid and elimina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/58
CPCH01L23/00H01L23/58G01D11/245H01L23/04
Inventor 蔡明志
Owner NUVOTON
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