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Integrated multifunctional micro-electro-mechanical sensor

A micro-electromechanical sensor and multi-functional technology, which is applied in the direction of electric solid-state devices, generators/motors, microelectronic microstructure devices, etc., can solve the problems of increased volume of micro-electromechanical sensors, redundant internal circuits, and difficult compatibility of signal interference factors. Issues such as clarification and assurance are obtained, and the effects of reducing the horizontal layout area, compact integrated layout design, and reducing signal mutual interference are achieved.

Active Publication Date: 2021-03-09
重庆忽米网络科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the existing structural process is used, simply integrate and arrange the internal process structures of multiple MEMS sensors with different functions in one package to form a multi-functional MEMS sensor, that is, multiple electronic wafers with micro-electromechanical sensing elements arranged Combined and integrated in the same package structure, not only is it easy to double the size of the MEMS sensor and the internal circuit is redundant, but also the signal interference factors between different MEMS sensing elements and the compatibility of different sensing signal acquisition and control Issues such as sexuality are difficult to be clarified and guaranteed

Method used

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  • Integrated multifunctional micro-electro-mechanical sensor

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Embodiment Construction

[0037] In order to solve the problems of miniaturization and working stability of the multifunctional microelectromechanical sensor, the present application provides an integrated multifunctional microelectromechanical sensor.

[0038] Such as figure 1 As shown, the integrated multifunctional micro-electromechanical sensor of the present invention includes a package structure 10, and an analog-to-digital conversion electronic wafer 20, a multi-channel signal acquisition electronic wafer 30 and a plurality of micro-electromechanical sensing elements 40 arranged in the package structure , each microelectromechanical sensor element 40 can be used to sense a different equipment status monitoring signal; an analog-to-digital conversion circuit with a plurality of analog signal input ports is formed on the analog-to-digital conversion electronic wafer 20, which is used to separately detect signals from each The analog signal at the signal input port is processed by analog-to-digital...

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Abstract

The present invention discloses an integrated multifunctional micro-electro-mechanical sensor. A signal acquisition circuit and an analog-to-digital conversion circuit are respectively integrated on different multi-channel signal acquisition electronic wafers and analog-to-digital conversion electronic wafers, and the multi-channel signal acquisition electronic wafers are designed and arranged onthe analog-to-digital conversion electronic wafers. A plurality of micro-electro-mechanical sensing elements are arranged on a multi-channel signal acquisition electronic wafer, so that the compact integrated layout design of the sensing elements, an acquisition circuit and an analog-to-digital conversion circuit structure is realized, the transverse layout area is reduced, and the miniaturizationof a multifunctional micro-electro-mechanical sensor product is facilitated; and meanwhile, the problem of signal mutual interference among different channels can be further reduced through the structural optimization design of the multi-channel signal acquisition electronic wafer, and the working stability of the integrated multifunctional micro-electromechanical sensor product is improved. Therefore, the integrated multifunctional micro-electro-mechanical sensor solution provided by the invention has a good market application prospect.

Description

technical field [0001] The invention relates to the technical fields of microelectromechanical sensor technology and industrial internet of things, in particular to an integrated multifunctional microelectromechanical sensor. Background technique [0002] Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System), also known as micro-electro-mechanical system, micro-system, micro-machine, etc. Circuits, high-performance electronic integrated devices, interfaces, and communications are integrated micro-devices or systems. MEMS focuses on ultra-precision machining. Common products include MEMS microphones, micro-motors, micro-pumps, micro-vibrators, MEMS sensors and other micro-electromechanical integrated products. [0003] Among them, micro-electromechanical sensors (MEMS sensors) refer to devices and systems that are processed by microelectronics and micro-machines, and use sensitive elements such as capacitors, piezoelectrics, piezoresistors, thermocouples, r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02
CPCB81B7/0074B81B7/008B81B7/02B81B2201/02
Inventor 巩书凯陈虎巴军邵慧
Owner 重庆忽米网络科技有限公司
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