An integrated edge calculator for condition monitoring based on MEMS sensor fusion

Abstract

The invention discloses an integrated state monitoring edge calculator based on micro-electromechanical sensor fusion, which integrates a signal acquisition circuit and a calculation processing circuit on different multi-channel signal acquisition electronic wafers and calculation processing electronic wafers respectively, The multi-channel signal acquisition electronic wafer is designed and arranged on the calculation processing electronic wafer, and multiple micro-electromechanical sensing elements are arranged on the multi-channel signal acquisition electronic wafer, realizing the structure of sensing elements, acquisition circuits, and calculation processing circuits The compact integrated layout design is conducive to the miniaturization of state monitoring edge calculator products; at the same time, it can further reduce the problem of signal mutual interference through the structural optimization design of multi-channel signal acquisition electronic wafers and calculation processing electronic wafers , to improve the working stability of integrated condition monitoring edge calculator products. It can be seen that the integrated condition monitoring edge calculator solution of the present invention has a good market application prospect.

Description

technical field [0001] The invention relates to the technical fields of micro-electromechanical sensor technology and industrial internet of things, in particular to an integrated status monitoring edge calculator based on micro-electromechanical sensor fusion. Background technique [0002] Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System), also known as micro-electro-mechanical system, micro-system, micro-machine, etc. Circuits, high-performance electronic integrated devices, interfaces, and communications are integrated micro-devices or systems. MEMS focuses on ultra-precision machining. Common products include MEMS microphones, micro-motors, micro-pumps, micro-vibrators, MEMS sensors and other micro-electromechanical integrated products. [0003] Among them, micro-electromechanical sensors (MEMS sensors) refer to devices and systems that are processed by microelectronics and micro-machines, and use sensitive elements such as capacitors, piezoelectri...

AI Technical Summary

Problems solved by technology

[0006] However, there are still technical barriers to relying on existing technologies to achieve the above technical goals

First of all, the process structure inside the packaging structure of the existing single-function MEMS sensor mainly includes micro-electromechanical sensing elements for performing signal sensing and acquisition, signal acquisition circuits for performing pre-processing such as signal acquisition control and filtering (analog circuit part) and the analog-to-digital conversion circuit (digital circuit part) for performing digital signal conversion, usually the signal acquisition circuit and the analog-to-digital conversion circuit are integrated on an electronic wafer, and the micro-electromechanical sensing elements are arranged on the electronic wafer And form a data transmission connection through conductive contacts; if the existing structural process is used, simply integrate and arrange the internal process structures of multiple MEMS sensors with different functions in one package to form a multi-functional MEMS sensor, that is, multiple arrangements The combination of electronic wafers with MEMS sensing elements is integrated and arranged in the same package structure, which not only easily causes the volume of the MEMS sensor to double, the internal circuit is redundant, but also the signal interference between different MEMS sensing elements Factors, compatibility of acquisition and control of different sensing signals, etc. are difficult to be clarified and guaranteed

Secondly, when there are still problems with the miniaturization and stability of multifunctional micro-electromechanical sensor devices, it becomes more difficult to further integrate edge computing processing circuits

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