Integrated state monitoring edge calculator based on micro-electro-mechanical sensor fusion

Abstract

The invention discloses an integrated state monitoring edge calculator based on micro electro mechanical system sensor fusion, which is characterized in that a signal acquisition circuit and a calculation processing circuit are respectively integrated on different multi-channel signal acquisition electronic wafers and calculation processing electronic wafers; a multi-channel signal acquisition electronic wafer is designed and arranged on a calculation processing electronic wafer, and a plurality of micro-electromechanical sensing elements are arranged on the multi-channel signal acquisition electronic wafer, so the compact integrated layout design of the structures of the sensing elements, an acquisition circuit and a calculation processing circuit is realized, and the miniaturization of astate monitoring edge calculator product is facilitated; meanwhile, the problem of signal mutual interference can be further reduced through the structural optimization design of the multi-channel signal acquisition electronic wafer and the calculation processing electronic wafer, and the working stability of the integrated state monitoring edge calculator product is improved. Therefore, the integrated state monitoring edge calculator solution provided by the invention has a good market application prospect.

Description

technical field [0001] The invention relates to the technical fields of micro-electromechanical sensor technology and industrial internet of things, in particular to an integrated status monitoring edge calculator based on micro-electromechanical sensor fusion. Background technique [0002] Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System), also known as micro-electro-mechanical system, micro-system, micro-machine, etc. Circuits, high-performance electronic integrated devices, interfaces, and communications are integrated micro-devices or systems. MEMS focuses on ultra-precision machining. Common products include MEMS microphones, micro-motors, micro-pumps, micro-vibrators, MEMS sensors and other micro-electromechanical integrated products. [0003] Among them, micro-electromechanical sensors (MEMS sensors) refer to devices and systems that are processed by microelectronics and micro-machines, and use sensitive elements such as capacitors, piezoelectri...

AI Technical Summary

Problems solved by technology

[0006] However, there are still technical barriers to relying on existing technologies to achieve the above technical goals

First of all, the process structure inside the packaging structure of the existing single-function MEMS sensor mainly includes micro-electromechanical sensing elements for performing signal sensing and acquisition, signal acquisition circuits for performing pre-processing such as signal acquisition control and filtering (analog circuit part) and the analog-to-digital conversion circuit (digital circuit part) for performing digital signal conversion, usually the signal acquisition circuit and the analog-to-digital conversion circuit are integrated on an electronic wafer, and the micro-electromechanical sensing elements are arranged on the electronic wafer And form a data transmission connection through conductive contacts; if the existing structural process is used, simply integrate and arrange the internal process structures of multiple MEMS sensors with different functions in one package to form a multi-functional MEMS sensor, that is, multiple arrangements The combination of electronic wafers with MEMS sensing elements is integrated and arranged in the same package structure, which not only easily causes the volume of the MEMS sensor to double, the internal circuit is redundant, but also the signal interference between different MEMS sensing elements Factors, compatibility of acquisition and control of different sensing signals, etc. are difficult to be clarified and guaranteed

Secondly, when there are still problems with the miniaturization and stability of multifunctional micro-electromechanical sensor devices, it becomes more difficult to further integrate edge computing processing circuits

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