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An Integrated Multifunctional MEMS Sensor

A micro-electro-mechanical sensor, multi-functional technology, applied in the direction of electric solid-state devices, generators/motors, micro-electronic microstructure devices, etc., can solve the problem of increasing the volume of micro-electro-mechanical sensors and the difficulty in clarifying and guaranteeing the compatibility of signal mutual interference factors , internal circuit redundancy and other problems, to achieve the effect of reducing the horizontal layout area, reducing signal mutual interference, and improving work stability

Active Publication Date: 2021-11-09
重庆忽米网络科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the existing structural process is used, simply integrate and arrange the internal process structures of multiple MEMS sensors with different functions in one package to form a multi-functional MEMS sensor, that is, multiple electronic wafers with micro-electromechanical sensing elements arranged Combined and integrated in the same package structure, not only is it easy to double the size of the MEMS sensor and the internal circuit is redundant, but also the signal interference factors between different MEMS sensing elements and the compatibility of different sensing signal acquisition and control Issues such as sexuality are difficult to be clarified and guaranteed

Method used

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  • An Integrated Multifunctional MEMS Sensor
  • An Integrated Multifunctional MEMS Sensor
  • An Integrated Multifunctional MEMS Sensor

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Embodiment Construction

[0037] In order to solve the problems of miniaturization and working stability of the multifunctional microelectromechanical sensor, the present application provides an integrated multifunctional microelectromechanical sensor.

[0038] like figure 1 As shown, the integrated multifunctional micro-electromechanical sensor of the present invention includes a package structure 10, and an analog-to-digital conversion electronic wafer 20, a multi-channel signal acquisition electronic wafer 30 and a plurality of micro-electromechanical sensing elements 40 arranged in the package structure , each microelectromechanical sensor element 40 can be used to sense a different equipment status monitoring signal; an analog-to-digital conversion circuit with a plurality of analog signal input ports is formed on the analog-to-digital conversion electronic wafer 20, which is used to separately detect signals from each The analog signal at the signal input port is processed by analog-to-digital co...

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Abstract

The invention discloses an integrated multifunctional micro-electromechanical sensor, which integrates a signal acquisition circuit and an analog-to-digital conversion circuit on different multi-channel signal acquisition electronic wafers and analog-to-digital conversion electronic wafers respectively, and multi-channel signal The acquisition electronic wafer is designed to be arranged on the analog-to-digital conversion electronic wafer, and multiple micro-electromechanical sensing elements are arranged on the multi-channel signal acquisition electronic wafer to realize the compact structure of the sensing element, acquisition circuit, and analog-to-digital conversion circuit. The integrated layout design reduces the horizontal layout area, which is conducive to the miniaturization of multi-functional micro-electromechanical sensor products; at the same time, it can further reduce the signal between different channels by optimizing the structure of the electronic wafer for multi-channel signal acquisition. Interference problems can be solved, and the working stability of integrated multi-function MEMS sensor products can be improved. It can be seen that the integrated multifunctional micro-electromechanical sensor solution of the present invention has a good market application prospect.

Description

technical field [0001] The invention relates to the technical fields of microelectromechanical sensor technology and industrial internet of things, in particular to an integrated multifunctional microelectromechanical sensor. Background technique [0002] Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System), also known as micro-electro-mechanical system, micro-system, micro-machine, etc. Circuits, high-performance electronic integrated devices, interfaces, and communications are integrated micro-devices or systems. MEMS focuses on ultra-precision machining. Common products include MEMS microphones, micro-motors, micro-pumps, micro-vibrators, MEMS sensors and other micro-electromechanical integrated products. [0003] Among them, micro-electromechanical sensors (MEMS sensors) refer to devices and systems that are processed by microelectronics and micro-machines, and use sensitive elements such as capacitors, piezoelectrics, piezoresistors, thermocouples, r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00B81B7/02
CPCB81B7/0074B81B7/008B81B7/02B81B2201/02
Inventor 巩书凯陈虎巴军邵慧
Owner 重庆忽米网络科技有限公司
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