Dipping equipment for printed circuit board
A printed circuit board and equipment technology, which is applied in the field of dipping equipment for printed circuit boards, can solve problems such as chapping, reducing the effect of device dipping soldering quality, pollution, etc., and achieve the effect of promoting movement
Active Publication Date: 2021-03-19
佛山市创微电子科技有限公司
View PDF8 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
And by setting the cutting foot mechanism, it overcomes the problem that when the cutting foot mechanism cuts the PCB board, the cutting pieces fall into the tin furnace of the tin furnace mechanism when it is arranged in a compact space, which will cause damage to the tin liquid. The problem of pollution, but the printed circuit board that has been dipped and soldered in this patent is prone to chapping due to excessive temperature difference during the cooling process, which reduces the effect of dip soldering quality of the device
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0040] see Figure 1-10 , an embodiment provided by the present invention: a dipping device for printed circuit boards, including a base 1, a dipping box 3, a fixed column 6, a fan box 7 and a limit frame 8, and a set of Groove 101, the base 1 increases the stability of the device by increasing the contact area between the device and the ground. The groove 101 can provide track guidance for the sliding of No. 1 workbench 2, which facilitates the movement of No...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a printed circuit board dipping device. The device comprises a base, a dipping box, a fan box and a limiting frame, wherein the top of the base is slidably connected with a first workbench through a groove, the dipping box is fixed to the top of the first workbench, a blocking net is connected to the interior of the dipping box, and a foaming box is fixed to the interior ofthe dipping box; a second workbench is welded to the surface of the top of the base, a fan box is fixed to the surface of the top of the second workbench, a fixing column is connected to the surfaceof the top of the base, a lifting column is slidably connected to the top of the fixing column, and a hanging plate is fixed to the surface of one side of the lifting column; and the bottom of the hanging plate is connected with a limiting frame. By arranging a series of assemblies, the tin liquid layer in the device can be continuously stirred in a high-density mode through bubbles generated by the bubble box when the device is used, and therefore the printed circuit board can be subjected to comprehensive and uniform dip soldering treatment.
Description
technical field [0001] The invention relates to the field of dipping technology, in particular to dipping equipment for printed circuit boards. Background technique [0002] Before the printed circuit board is processed and put into production, it needs to be dipped to ensure the fixity of internal parts. The dipping operation is also called dip soldering operation. The printed circuit board is immersed in the heated tin liquid, The fluidity and permeability of the tin liquid liquid can realize the dip soldering operation on the surface of the printed circuit board, and then strengthen the stability of the internal components of the printed circuit board. Therefore, a dipping equipment is needed to assist the enterprise to carry out related printed circuit board dipping operations. operate. [0003] The defective that existing dipping equipment exists is: [0004] Reference document CN 103658910 A discloses a fully automatic dip soldering machine, which includes a body, a ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 郑艳艳
Owner 佛山市创微电子科技有限公司