A kind of dipping equipment for printed circuit board
A technology for printed circuit boards and equipment, applied in the field of dipping equipment for printed circuit boards, can solve problems such as pollution, the effect of reducing the quality of equipment dip soldering, chapping, etc., and achieve the effect of ensuring normal work, avoiding the influence of rust, and promoting movement.
Active Publication Date: 2022-08-09
佛山市创微电子科技有限公司
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Problems solved by technology
And by setting the cutting foot mechanism, it overcomes the problem that when the cutting foot mechanism cuts the PCB board, the cutting pieces fall into the tin furnace of the tin furnace mechanism when it is arranged in a compact space, which will cause damage to the tin liquid. The problem of pollution, but the printed circuit board after the dip-soldering of the patent is easy to cause chapping due to excessive temperature difference during the cooling process, which reduces the effect of dip-soldering quality of the equipment
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[0039] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0040] see Figure 1-10 , an embodiment provided by the present invention: a printed circuit board dipping equipment, including a base 1, a dipping box 3, a fixed column 6, a fan box 7 and a limit frame 8, the top surface of the base 1 is provided with a set of The groove 101, the base 1 increases the stability of the device by increasing the contact area between the device and the ground. The groove 101 can provide track guidance for...
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The present invention discloses a dipping device of the printing circuit board, including the base, the dipping box, the fan box, and the limit box.There is a dipped box at the top, which is connected to the internal connection of the dipped box with a block. The internal fixation of the dipped box is fixed with a bubble box, and the bubble box is below the block.The workbench, a fan box on the top surface of the No. 2 workbench, is connected to a fixed column on the top surface of the base.Hanging board, the bottom of the hanging board is connected to the limited number box.The present invention has a series of components that allow this device to continuously and high density of the tin liquid layer inside the device through the foam produced by the bubble, so that the printing circuit board can get a more comprehensive and uniform immersionWelding treatment.
Description
technical field [0001] The invention relates to the technical field of dipping, in particular to a dipping device for printed circuit boards. Background technique [0002] Before the printed circuit board is processed and needs to be put into production, it needs to be dipped in order to ensure the fixation of the internal components. The dipping operation is also called the dip soldering operation. The fluidity and permeability of the tin liquid liquid can realize the dip soldering operation on the surface of the printed circuit board, thereby enhancing the stability of the internal parts of the printed circuit board. Therefore, a dip dip equipment is needed to assist enterprises in the related printed circuit board dip dip. operate. [0003] The existing dipping equipment has the following defects: [0004] Reference document CN 103658910 A discloses an automatic dip soldering machine, comprising a body, a transmission mechanism mounted on the body and a control circuit ...
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IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 郑艳艳
Owner 佛山市创微电子科技有限公司