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A bonding process for v-skinned honeycomb sandwich structure

A technology of honeycomb sandwich and skin is applied in the field of bonding technology of V-shaped skin honeycomb sandwich structure to achieve the effects of reducing production cost, improving molding quality and reducing process difficulty

Active Publication Date: 2022-04-12
AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the bonding of the honeycomb sandwich structure of the V-shaped skin structure, especially for the bonding process of the channel beam structure, it also poses a great challenge

Method used

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  • A bonding process for v-skinned honeycomb sandwich structure
  • A bonding process for v-skinned honeycomb sandwich structure
  • A bonding process for v-skinned honeycomb sandwich structure

Examples

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Embodiment Construction

[0033] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The detailed description and accompanying drawings of the following embodiments are used to illustrate the principles of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments, without departing from the spirit of the present invention Any modification, substitution and improvement of parts, components and connection methods are covered under.

[0034] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0035] figure 1 is a structural schematic diagram of an embodiment of the present invention, su...

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Abstract

The invention relates to a bonding process for a V-shaped skin honeycomb sandwich structure, comprising step 1, fixing the adhesive film on the V-shaped skin; step 2, positioning the V-shaped skin with a special mold; and step 3 , after the overall packaging of the V-shaped skin and the special mold, the honeycomb verification is carried out, and the honeycomb indentation on the V-shaped skin film is observed; Step 4: If the indentation is uniform, the V-shaped skin and the special mold after the isolation film are removed The mold is repackaged as a new overall structure, and the new overall structure after repackaging is heated up for bonding. The invention pre-fixes the adhesive film in the V-shaped skin and uses a special mold for positioning. The special mold and the V-shaped skin Carry out honeycomb bonding verification, and glue the V-shaped skin with uniform film indentation and special mold after repackaging, so that the adhesive film in the V-shaped skin can be firmly bonded to the skin, and the V-shaped skin can be effectively avoided. Glue defects during skin forming.

Description

technical field [0001] The invention relates to the field of bonding of metal structures, in particular to a bonding process for a V-shaped skin honeycomb sandwich structure. Background technique [0002] In the field of aviation equipment maintenance, it is often faced with the problem that some parts cannot meet the requirements due to the expiration of the preparation life, but the parts have been discontinued or difficult to purchase and the cost is high. Remanufacturing technology is already an important means to restore the performance of weapons and equipment. Remanufacturing repairs can effectively prolong the life of aviation equipment and improve its performance by restoring the original size of damaged parts, restoring or improving their performance. In the repair process of existing aviation equipment, damage to the components of the honeycomb sandwich glued structure is often common, and remanufacturing technology is widely used in it. For the bonding of the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B64F5/50
CPCB64F5/50
Inventor 范雨娇宋旻键白树成蔡良元王新庆姜茂川曾安民斯奎朱慧斌
Owner AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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