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Semiconductor structure and manufacturing method thereof

A technology of semiconductor and rewiring structure, applied in semiconductor/solid-state device manufacturing, semiconductor device, semiconductor/solid-state device components and other directions

Inactive Publication Date: 2021-03-26
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These relatively new types of semiconductor packaging technologies face manufacturing challenges

Method used

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  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof
  • Semiconductor structure and manufacturing method thereof

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Embodiment Construction

[0018] The following disclosure provides many different embodiments or examples for implementing various features of the presented subject matter. To simplify the present disclosure, specific examples of components and arrangements are set forth below. Of course, these are only examples and are not intended to be limiting. For example, reference in the following description to forming a first feature "on" or "on" a second feature may include embodiments in which the first feature and the second feature are formed in direct contact, and may also include Embodiments wherein additional features may be formed between the first and second features such that the first and second features may not be in direct contact. Additionally, the present disclosure may reuse reference numbers and / or letters in various instances. Such reuse is for the purpose of brevity and clarity and is not itself indicative of a relationship between the various embodiments and / or configurations discussed. ...

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Abstract

A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes an integrated circuit (IC) component, an insulating layer laterally encapsulating sidewalls of the IC component, a redistribution structure disposed on the insulating layer and the IC component, and a warpage control portion coupling to a back side of the IC component opposite to the redistribution structure. The redistribution structure is electrically connected to the IC component. The warpage control portion includes a substrate, a patterned dielectric layer disposed between the substrate and the IC component, and a metal pattern embedded in the patterned dielectric layer and electrically isolated from the IC component.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor structure and a method for fabricating the same, and more particularly, to a semiconductor structure including a warpage control portion and a method for fabricating the same. Background technique [0002] The semiconductor industry has experienced rapid growth due to continuous improvements in the integration density of various electronic components (eg, transistors, diodes, resistors, capacitors, etc.). To a large extent, these improvements in integration density come from the continuous reduction of the minimum feature size, which enables more components to be integrated into a given area. Technological advances in integrated circuit (IC) design have produced generations of ICs, each of which has a smaller and more complex circuit design than the previous generation. Examples of semiconductor device packaging types include three-dimensional integrated circuits (3DICs). These relatively...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/48H01L23/485H01L23/498H01L21/56H01L21/60
CPCH01L23/3185H01L23/4824H01L23/481H01L23/49838H01L24/03H01L21/56H01L2224/0231H01L2224/02381H01L2224/02331H01L2224/02379H01L2224/02372H01L21/6835H01L2221/68345H01L2221/68359H01L23/562H01L25/0655H01L23/3128H01L2224/08237H01L2224/80006H01L2224/95H01L2924/3511H01L2224/96H01L2224/9222H01L2224/32225H01L2224/09181H01L2224/08146H01L2224/08235H01L24/08H01L24/80H01L24/96H01L2224/80895H01L2224/80896H01L2224/09517H01L23/49816H01L23/5383H01L23/15H01L2224/08145H01L2224/06152H01L2224/80001H01L2224/83H01L2924/00014H01L24/05H01L23/3121H01L2224/02371H01L24/29
Inventor 陈明发陈宪伟陈洁
Owner TAIWAN SEMICON MFG CO LTD