Integrated circuit module subpackage packing box
An integrated circuit and packaging box technology, which is applied in the field of subcontracting packaging boxes for integrated circuit components, can solve problems such as deformation of the original extrusion pins, damage to the integrated circuit, deformation of the packaging box, etc., and achieves increased friction, low production costs, and slip prevention shift effect
Inactive Publication Date: 2021-04-02
合肥高地创意科技有限公司
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Problems solved by technology
[0002] With the development of integrated circuit technology, the packaging requirements of integrated circuits are becoming more and more stringent. The packaging of integrated circuit originals is also very important for the preservation and transportation of integrated circuit originals. Because integrated circuit originals are generally smaller in size and have thinner pins , the use of general horizontal plastic card slot packaging can easily cause the extrusion of the original and the deformation of the pins, and the use of vertical slot packaging is not conducive to human operation, and the packaging box is easily deformed due to the force during transportation. integrated circuit damage
Method used
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[0037] Please refer to the attached Figure 1-7 , a sub-packaging packaging box for integrated circuit components, comprising:
[0038] The outer box body 1, the outer box body 1 is in the shape of a cuboid, and is composed of an upper waterproof panel 11, a lower waterproof panel 12, a left waterproof panel 13, a right waterproof panel 14, a front waterproof panel 15 and a rear waterproof panel 16;
[0039] Further, the outer box body 1 is made of a piece of cardboard, which has high production efficiency, low production cost, meets environmental protection requirements, and is easy to recycle;
[0040] The label column 4 is formed on the front waterproof panel 15;
[0041] Further, information such as product batches and dates can be filled in the set label column 4, which is convenient for users to find;
[0042] The inner box body 2, including the bottom plate 21, is formed in the outer box body 1;
[0043] Further, because the volume of the original integrated circuit ...
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The invention discloses an integrated circuit module subpackage packing box. The packing box comprises an outer-layer box body, a tab bar, an inner-layer box body and a supporting part, wherein the outer-layer box body is in a cuboid shape, and the outer-layer box body is formed an upper waterproof panel, a lower waterproof panel, a left waterproof panel, a right waterproof panel, a front waterproof panel and a rear waterproof panel; the tab bar is arranged on the front waterproof panel; the inner-layer box body comprises a bottom plate and is arranged in the outer-layer box body; and the supporting part is arranged between the outer-layer box body and the inner-layer box body. An integrated circuit original is packaged through two layers of the arranged box bodies, damage caused by jolting in the transportation process is prevented, and the problems that the size of the integrated circuit original is generally small, pins are thin, and the packaging of the integrated circuit originalis very important for the storage and transportation of the integrated circuit original are solved.
Description
technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and in particular relates to an integrated circuit component packaging box. Background technique [0002] With the development of integrated circuit technology, the packaging requirements of integrated circuits are becoming more and more stringent. The packaging of integrated circuit originals is also very important for the preservation and transportation of integrated circuit originals. Because integrated circuit originals are generally smaller in size and have thinner pins , the use of general horizontal plastic card slot packaging can easily cause the extrusion of the original and the deformation of the pins, and the use of vertical slot packaging is not conducive to human operation, and the packaging box is easily deformed due to the force during transportation. IC damage. Contents of the invention [0003] The object of the present invention is to provide a packaging ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B65D25/10B65D81/07B65D81/05B65D85/90
CPCB65D25/10B65D81/052B65D81/07B65D2585/86
Inventor 陈圆圆
Owner 合肥高地创意科技有限公司