Branched polyethyleneimine, synthesis method thereof and application of branched polyethyleneimine as leveling agent in electroplating liquid

A technology of polyethyleneimine and synthesis method, which is applied in jewelry and other fields, can solve the problems of filling voids, weak deep plating ability of through holes, etc., achieve moderate hole filling speed, good board surface appearance, and is conducive to the reliability of electronic products Effect

Inactive Publication Date: 2021-04-06
广州市慧科高新材料科技有限公司
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Problems solved by technology

[0006] In view of this, the first purpose of the present invention is aimed at the problem in the prior art that the through-hole deep plating ability of the copper plating solution is weak or easily produces the hole filling void due to the leveling agent in the copper plating solution, and provides A kind of synthetic method of branched type polyethylenimine

Method used

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  • Branched polyethyleneimine, synthesis method thereof and application of branched polyethyleneimine as leveling agent in electroplating liquid
  • Branched polyethyleneimine, synthesis method thereof and application of branched polyethyleneimine as leveling agent in electroplating liquid
  • Branched polyethyleneimine, synthesis method thereof and application of branched polyethyleneimine as leveling agent in electroplating liquid

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preparation example Construction

[0038] A kind of synthetic method of branched type polyethylenimine, comprises the following steps:

[0039] (1) reacting a nitrogen-containing cyclic compound and a polyepoxide to obtain a branched intermediate;

[0040] (2) Add polyethyleneimine to the branched intermediate to complete the grafting reaction to obtain the electroplating copper hole filling and leveling agent-like branched polyethyleneimine.

[0041] Preferably, the nitrogen-containing cyclic compound is selected from cyclohexylamine, cyclobutylamine, cyclopentylamine, aniline, pyridine, pyrrolidine, morpholine, or a nitrogen atom containing a methyl, ethyl or aryl substituent of the aforementioned compounds.

[0042] Preferably, the polyepoxide is a compound containing three or more epoxy groups, preferably glycerol triglycidyl ether, trimethylolpropane triglycidyl ether, castor oil triglycidyl ether , four polyglycerol tetraglycidyl ether or six polyglycerol hexaglycidyl ether.

[0043] Preferably, the mo...

Embodiment 1

[0051] Cyclohexylamine is selected as the nitrogen-containing cyclic compound.

[0052]The polyepoxide is glycerol triglycidyl ether.

[0053] The structural formula of the intermediate is as follows:

[0054]

Embodiment 2

[0056] The nitrogen-containing cyclic compound is selected from piperidine.

[0057] The polyepoxide is glycerol triglycidyl ether.

[0058] The structural formula of the intermediate is as follows:

[0059]

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Abstract

The invention belongs to the technical field of surface treatment, and discloses branched polyethyleneimine, a synthesis method thereof and an application of the branched polyethyleneimine as a leveling agent in electroplating liquid. The synthesis method of the branched polyethyleneimine comprises the following steps: reacting a nitrogen-containing cyclic compound with a polyepoxy compound to obtain a branched intermediate, and carrying out grafting reaction on the branched intermediate and polyethyleneimine to obtain the branched polyethyleneimine. The branched polyethyleneimine is matched with a known wetting agent and an accelerator to form an acid copper type electroplating hole filling additive, and then the acid copper type electroplating hole filling additive is added into electroplating liquid, so that the branched polyethyleneimine is applied to a through hole or a blind hole in a semiconductor substrate or a printed circuit board to realize all-copper filling.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, and in particular relates to a kind of branched polyethyleneimine, its synthesis method and its application as a leveling agent in electroplating solution. Background technique [0002] In recent years, substrate lamination methods typified by build-up methods have been widely used as circuit mounting methods for electronic devices such as portable terminals, personal computers, video recorders, and game machines. In this stacking method, laser drill blind holes on multi-layer boards, and deposit them in a "super conformal angle" mode through acid copper plating and suitable additives to achieve full copper filling of blind holes. [0003] The core of the additive deposited in the "super-constant angle" mode is the leveling agent. There are two types of leveling agents known in the prior art, both of which are polycondensation polymers: [0004] (1) The reaction condensate of amines an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/04C25D3/38C25D5/02C25D7/00
CPCC08G73/0206C08G73/0213C25D3/38C25D5/02C25D7/00
Inventor 张之勇罗东明
Owner 广州市慧科高新材料科技有限公司
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