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Wafer caching device and chemical mechanical polishing system

A wafer and cache technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as interfering with the state determination of the support frame and affecting the normal operation of the transmission manipulator, to ensure smoothness, improve accuracy, reduce Detecting the effect of interference

Inactive Publication Date: 2021-04-13
HWATSING TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This will interfere with the state judgment of the adjacent support frame, and even cause misjudgment and affect the normal operation of the transfer manipulator.

Method used

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  • Wafer caching device and chemical mechanical polishing system
  • Wafer caching device and chemical mechanical polishing system
  • Wafer caching device and chemical mechanical polishing system

Examples

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Embodiment Construction

[0028] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions.

[0029] The accompanying drawings in this specification are schematic diagrams, which assist in explaining the concept of the...

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Abstract

The invention discloses a wafer caching device and a chemical mechanical polishing system. The wafer caching device comprises a support frame and a detection assembly, the support frame is used for horizontally supporting a wafer, and the detection assembly is arranged at the peripheral side of the support frame; the detection assembly comprises a signal receiving and transmitting part and a reflection part arranged in a matched mode, an optical signal output by the signal receiving and transmitting part is emitted towards the reflection part, and the reflection part reflects the optical signal to the signal receiving and transmitting part; and the detection assembly judges whether the wafer is placed on the support frame or not according to the optical signal received by the signal receiving and transmitting part.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a wafer buffer device and a chemical mechanical polishing system. Background technique [0002] In the semiconductor industry, wafers need to be processed and manufactured through various process steps and even different semiconductor equipment. Among them, the handling manipulator undertakes the task of wafer transfer. Due to the different processing techniques of the wafers, there are differences in the production cycle of each process. The wafers cannot be directly transferred to the next process, nor can they simply stay on the manipulator for buffering, but need to be placed in the wafer buffering device. [0003] figure 1 Shown is a prior art wafer buffer device configured with stacked support frames. In order to control the movement of the transfer robot, it is necessary to determine in advance whether or not a wafer is placed on the support frame. Cu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673H01L21/67
CPCH01L21/67346H01L21/67265H01L21/67092
Inventor 许振杰肖莹孙传恽郑树茂
Owner HWATSING TECH
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