Unlock instant, AI-driven research and patent intelligence for your innovation.

Stacked die assembly

A technology of semiconductor tubes and sensor equipment, applied in the field of sensor equipment, to achieve the effect of simplifying the design

Pending Publication Date: 2021-04-13
メレクシステクノロジーズソシエテアノニム
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There is always room for improvement and substitution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stacked die assembly
  • Stacked die assembly
  • Stacked die assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0118] The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims. The drawings described are only schematic and non-limiting. In the drawings, the size of some of the elements may be exaggerated and not drawn on scale for illustrative purposes. The scale and relative scale do not correspond to actual reductions to practice of the invention.

[0119] Furthermore, the terms first, second, etc. in the description and in the claims are used to distinguish between similar elements and not necessarily to describe an order in time, space, in rank or in any other way. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in sequences other than described or illustrated herein.

[0120] Additionally, the terms top, bottom, etc. in the d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a stacked die assembly. A sensor device (1) comprising: a lead frame (9); a first / second semiconductor die (2a) having a first / second sensor structure (4a, 14a) at a first / second sensor location (L1, L2), and a plurality of first / second bond pads (7a, 7b) electrically connected to the lead frame (9); the semiconductor dies each have a square or rectangular shape with a geometric center (6a); the sensor locations (L1, L2) are offset from the geometrical centers; the second die (2b) is stacked on top of the first die (2a), and is rotated by a non-zero angle and optionally also offset or shifted (DX, DY) with respect to the first die (2a), such that the perpendicular projections of the first and second sensor locations (L1, L2) coincide.

Description

technical field [0001] The present invention relates to the field of sensor devices, and more particularly to a sensor device for use in an automotive environment, the sensor device comprising two semiconductor dies, one for performing actual measurements and one for performing redundant measurements. Background technique [0002] Sensor devices with high reliability are important in a wide variety of applications, such as for example in automotive applications. Furthermore, it is often preferred to include a plurality of substantially identical sensors (eg two sensors) to provide redundancy (eg in applications where ensuring safety is critical). [0003] Redundant sensor devices are known in the art, where multiple substrates, each containing at least one sensor, are combined in a single package to provide actual sensor measurements and redundant sensor measurements. A device in which two substrates are placed side by side requires a larger footprint, which is undesirable....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L25/065G01R33/02
CPCH01L23/49575H01L25/0657G01R33/02H01L2225/06555H01L2224/48247G01D5/145G01R33/07H01L2224/32245H01L2224/73265H01L2224/04042H01L2224/32145H01L2224/48091H01L24/32H01L24/48H01L24/73G01R33/0005G01R33/09G01R33/038G01R33/0052G01D5/14G01R33/0047G01R33/072G01R33/091H01L24/49H01L2224/06135H01L2224/48465H01L2924/181H01L2924/00012H01L2924/00014H01L2224/32225H01L23/49541H10N52/80H10N52/101
Inventor A·拉维尔E·拉海伊陈健
Owner メレクシステクノロジーズソシエテアノニム