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Plate bundle for plate-fin heat exchanger and plate-fin heat exchanger

A plate-fin heat exchanger and plate bundle technology, applied in the field of plate-fin heat exchangers, can solve problems such as insufficient intermediate pressure bearing capacity, achieve the effects of enhancing pressure bearing capacity, ensuring flow, and improving intermediate pressure bearing capacity

Pending Publication Date: 2021-04-20
杭州微控节能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of insufficient pressure bearing capacity in the middle of the plate bundle of the plate-fin heat exchanger in the prior art, thereby providing a plate bundle for the plate-fin heat exchanger

Method used

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  • Plate bundle for plate-fin heat exchanger and plate-fin heat exchanger
  • Plate bundle for plate-fin heat exchanger and plate-fin heat exchanger
  • Plate bundle for plate-fin heat exchanger and plate-fin heat exchanger

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Embodiment Construction

[0035] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention provides a plate bundle for a plate-fin heat exchanger and the plate-fin heat exchanger, and belongs to the technical field of plate-fin heat exchangers. The plate bundle comprises a plurality of fins sequentially arranged in a stacked manner and partition plates; and through holes are formed in the fins, supporting blocks are arranged in the through holes, and the upper ends and the lower ends of the supporting blocks abut against the upper partition plate and the lower partition plate respectively. According to the plate bundle for the plate-fin heat exchanger, the supporting blocks are additionally arranged in channels, so that the middle pressure bearing capacity of the plate bundle is improved; and meanwhile, due to the arrangement of the supporting blocks, the appearance structure of the plate bundle cannot be changed, the appearance size of the plate bundle cannot be increased, and the appearance of the plate bundle is more regular and attractive.

Description

technical field [0001] The invention relates to the technical field of plate-fin heat exchangers, in particular to a plate bundle for the plate-fin heat exchanger and the plate-fin heat exchanger. Background technique [0002] The plate bundle of a plate-fin heat exchanger is usually composed of side plates, partitions, fins, and seals. A sandwich composed of fins and seals is placed between two adjacent partitions, which is called a channel. Stacking such interlayers according to different fluid methods and welding them into a whole will form a plate bundle. The plate bundle is the core of the plate-fin heat exchanger, and it will form a plate-fin heat exchanger with necessary heads, connecting pipes, supports, etc. Heat Exchanger. [0003] At present, the pressure bearing capacity of the plate-fin heat exchanger is limited, and there are limitations to the heat exchange between media with high pressure. Contents of the invention [0004] Therefore, the technical probl...

Claims

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Application Information

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IPC IPC(8): F28F3/08F28F3/10F28F3/04F28D9/00
Inventor 任来超蒋健安冯付韬付敏翔丁旭蒋卫波范云涛杨代坤石景祯杨超
Owner 杭州微控节能科技有限公司
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