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Electrical connectivity between detachable components

A technology for connectors and connection surfaces, applied in connection, fixed connection, electrical components, etc., can solve problems such as corrosion of electrical contacts, loss of connectivity, and hindrance of DICD connectivity

Active Publication Date: 2021-04-20
GOPRO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, repeated connection and disconnection of the ISLA can result in damage to the electrical connector, which is typically surface mounted to a supporting substrate such as a printed circuit board (PCB)
For example, such damage may occur due to shear (lateral) forces experienced during repeated connection and disconnection of the ISLA, which eventually degrades the connection between the connector pins and the substrate over time and causes Broken or Lost Connectivity
[0004] In addition, the DICD and / or ISLA(s) may be exposed over time to environmental or occasional moisture, dirt, debris, etc., including, for example, rain, salt water, sweat, grit, and dust, which may cause Corrosion of the electrical contacts, thereby impeding (or completely blocking) the connectivity between the DICD and the ISLA(s)

Method used

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  • Electrical connectivity between detachable components
  • Electrical connectivity between detachable components
  • Electrical connectivity between detachable components

Examples

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Embodiment Construction

[0027] The present disclosure describes a method for protecting and maintaining electrical connectivity between detachable parts and reducing (or preventing) electrical contacts (eg, connector pins) in the presence of water, moisture, and / or debris. Corrosion structures and methods. Throughout this disclosure, use of the terms "water" and "moisture" should be understood to include any and all environmental and / or occasional moisture (e.g., rain, salt water, sweat, and / or humidity) that may cause corrosion of electrical contacts. ).

[0028] By way of illustration, the structures and methods described herein are discussed in the context of a digital image capture device (DICD) and an interchangeable integrated sensor-lens assembly (ISLA). It should be appreciated, however, that the principles of the present disclosure may be applied to any system or platform that includes electrically connected and / or disconnectable power sources, such as batteries and battery extensions, as e...

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PUM

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Abstract

In one aspect of the present disclosure, a digital image capturing device (DICD) is disclosed that includes a device body with a printed circuit board (PCB), and an integrated sensor-lens assembly (ISLA) that is configured for releasable connection to the device body. The PCB defines a plurality of openings that extend therethrough and includes a plurality of connector pins that are fixedly positioned within the openings. The ISLA includes at least one connective surface that is configured for contact with the connector pins to establish electrical communication between the device body and the ISLA.

Description

technical field [0001] The present disclosure generally relates to establishing electrical connections between removable components. For example, in one implementation, the present disclosure relates to establishing electrical connections between a digital image capture device (DICD) and one or more detachable integrated sensor-lens assemblies (ISLAs). Background technique [0002] DICDs are used in a variety of applications including, for example, handheld cameras and video recorders, drones, and vehicles. A DICD typically includes one or more optical elements (eg, lenses) and one or more image sensors. The optical element(s) captures content by receiving and focusing light, and the captured content is converted into an electronic signal by an image sensor. Signals generated by the image sensor are then processed by an image signal processor to form an image. In some DICDs, the optical element(s) and image sensor(s) are incorporated into a single unit called an integrate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03B17/12H01R12/55G03B30/00
CPCH01R12/714H01R12/718G03B17/02G03B2217/002G03B2217/007G03B2206/00G03B17/14H04N23/54H04N23/55H04N23/57H04N23/65
Inventor P·芬克尔
Owner GOPRO