A device for removing tin balls from a BGA ball-mounted ball board, a BGA ball-mounting machine and a method

Abstract

The invention is applicable to the technical field of chip packaging BGA ball planting. The invention discloses a BGA ball planting board solder ball removal device, a BGA ball planting machine and a method, wherein the ball board solder ball removal device includes a pneumatic vibration mechanism that vibrates the upper ball planting board and / or the lower ball planting board, The pneumatic vibrating mechanism includes a vibrator main body provided with a cavity and a movable cavity core located in the cavity, wherein the vibrator main body is provided with an air inlet and an air outlet respectively communicated with the cavity, and the air inlet It is connected with the pressure gas; the cavity core includes an impact end and a free end, and the free end is provided with a step that enables a cavity to be formed between the cavity core and the cavity body, and an axial blind hole is provided along the axial direction, and the axial blind The hole communicates with the radial hole arranged radially at the free end of the cavity core. Since the reciprocating stroke of the cavity core and the impact force and frequency can be adjusted by the pressure gas, the vibration amplitude can be effectively controlled, and the position accuracy of the residual solder ball can be improved. At the same time, it also needs a larger vibration space, and its structure is simple and compact.

Description

technical field [0001] The invention relates to the technical field of chip packaging BGA ball mounting, in particular to a BGA ball mounting board solder ball removing device, a BGA ball mounting machine and a method. Background technique [0002] Chip packaging usually adopts BGA (Ball Grid Array, ball grid array packaging), and the solder balls are transplanted to the points corresponding to the chip pins. Usually, an upper and lower ball-mounting board is used, wherein the lower ball-mounting board is provided with micro-holes to arrange tin balls or tin balls, so that they are distributed according to the pins of the packaged chip, and then pass through the correspondingly distributed micro-holes on the upper ball-mounting board under the action of negative pressure. All the solder balls on the lower ball board are adsorbed and transplanted to the chip packaging substrate, so that the substrate and each pin of the chip form an electrical lead to complete the packaging. ...

AI Technical Summary

Problems solved by technology

However, due to the large-angle rotation and large-amplitude vibration of the upper ball planting board, there may be residual solder balls or solder balls that cannot fall into the designated position of the substrate, which may lead to ball planting failure, so its effect is not good.

At the same time, when the upper and lower ball planting boards are larger, a larger space needs to be provided

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