BGA ball mounting plate solder ball removing device, BGA ball mounting machine and method

Abstract

The method is suitable for the technical field of chip packaging BGA ball mounting. The invention discloses a ball grid array (BGA) ball mounting plate solder ball removing device, a BGA ball mounting machine and a method, the ball mounting plate solder ball removing device comprises a pneumatic vibration mechanism enabling an upper ball mounting plate and/or a lower ball mounting plate to vibrate, and the pneumatic vibration mechanism comprises a vibrator main body provided with a cavity and a movable cavity core located in the cavity; the vibrator main body is provided with a gas inlet and a gas outlet which are respectively communicated with the cavity, and the gas inlet is connected with pressure gas; the cavity core comprises an impact end and a free end, the free end is provided with a step capable of forming a cavity between the cavity core and the cavity body and an axial blind hole formed in the axial direction, and the axial blind hole is communicated with a radial hole formed in the free end of the cavity core in the radial direction. As the reciprocating stroke, the impact force and the frequency of the cavity core can be adjusted through the pressure gas, the vibration amplitude is effectively controlled, and the falling position precision of residual solder balls is improved. Meanwhile, a large vibration space is also needed, and the structure is simple and compact.

Description

technical field [0001] The invention relates to the technical field of chip packaging BGA ball planting, in particular to a device for removing solder balls from a BGA ball planting board, a BGA ball planting machine and a method. Background technique [0002] The chip package usually adopts BGA (Ball Grid Array, ball grid array package), and the solder balls are transplanted to the points corresponding to the chip pins. Usually, upper and lower ball planting boards are used, wherein the lower ball planting board is equipped with micro-holes to arrange solder balls or tin beads, so that they are distributed according to the pins of the packaged chip, and then pass through the corresponding distribution of micro-holes on the upper ball planting board under the action of negative pressure. All the solder balls on the ball-mounting board are adsorbed and transplanted to the chip packaging substrate, so that the substrate and each pin of the chip form an electrical connection, a...

AI Technical Summary

Problems solved by technology

However, due to the large-angle rotation and large-amplitude vibration of the upper ball planting board, there may be residual solder balls or solder balls that cannot fall into the designated pos...

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