Full-automatic SMT chip mounter and chip mounting process thereof

Abstract

The invention discloses a full-automatic SMT chip mounter and a chip mounting process thereof, and particularly relates to the technical field of chip mounters; the full-automatic SMT chip mounter comprises a chip mounter, a material conveying control mechanism is arranged on the surface of the chip mounter, the material conveying control mechanism comprises a shell, the shell is arranged on the surface of the chip mounter, and the back of the shell is fixedly connected with the front of a piston shell. And two cavities are formed in the piston shell. The improved novel material conveying control mechanism is adopted, the control function of the material conveying control mechanism is completely controlled by a displacement mechanism of the chip mounter, full-automatic chip mounting work can be achieved without additionally arranging a machine grabbing station, the mode that chip mounting can be achieved through downward pressing is simpler, time is greatly saved, and the machining efficiency is improved. And moreover, the chip mounter can achieve a limiting effect while discharging, so that the chip mounting deviation is avoided, the chip mounting accuracy is guaranteed, the reworking problem is solved, and the production benefit can be better guaranteed.

Description

technical field [0001] The invention relates to the technical field of placement machines, more specifically, the invention relates to a fully automatic SMT placement machine and a placement process thereof. Background technique [0002] With the continuous development of science and technology, fully automatic SMT placement is the main component of the production of SMT, and it is widely used in the production of electronic original devices. In the production line, the automatic SMT placement machine is configured on the dispenser or screen After the printing machine, it is a device that accurately places surface mount components on the PCB pads by moving the placement head. [0003] In the prior art, the suction nozzle mechanism of the automatic SMT placement machine is generally used to absorb the material on the surface of the material tray, and then move to a suitable position on the surface of the circuit board to paste the material, and the suction nozzle mechanism ci...

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Problems solved by technology

[0004] In order to overcome the above-mentioned defects of the prior art, the invention provides a full-automatic SMT placement machine and its placement process. The suction nozzle mechanism first absorbs the material on the surface of the material tray, and then moves to a suitable position on the surface of the circuit board to paste the material, and the circular movement of the suction nozzle mechanism between the material tray and the circuit board will not only waste a long time , and in the process of adsorption or placement, it is easy to be tilted by other external forces, which will affect the placement accuracy, easily lead to unqualified matching of the circuit board, and even occurrence of placement deviation, which will affect the rework of the circuit board and the production efficiency.

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