An air-cooled and heat-dissipating modular reinforced computer

Abstract

The invention discloses an air-cooled and heat-dissipating modular reinforced computer, which comprises: a shell, the top and the front side of which are open; A cooling air duct is formed between the left side of the housing and the inner wall of the housing, and an air outlet corresponding to the cooling air duct is provided on the rear side wall of the housing; a wiring area is formed between the rear side of the inner housing and the inner wall of the housing; the fan module, Installed on the front side of the heat dissipation air duct and detachably connected with the outer shell; the top cover plate is pressed on the inner shell and connected with the outer shell to seal the top of the outer shell; the functional module is connected with the outer shell and partially inserted into the inner shell to set There are multiple, multiple functional modules that seal the front side of the inner housing. According to an air-cooled and heat-dissipating modular reinforced computer according to an embodiment of the present invention, each component adopts a modular design, which is easy to install and operate, convenient to maintain, and has high heat dissipation efficiency; each module is tightly installed, and it is firm and convenient to use.

Description

technical field [0001] The invention relates to the field of computers, in particular to an air-cooled and heat-dissipating modular reinforced computer. Background technique [0002] The heat dissipation, electromagnetic shielding and dustproof schemes of the existing electronic equipment such as computers or servers are basically by adding fans at the positions of the front and rear cover plates of the chassis or adding fans at the positions of the upper and lower cover plates, and adding corresponding air ducts and air deflectors inside the chassis. At the same time, air inlet and outlet holes are opened on the corresponding side, and components such as shielding waveguide structure (to ensure good electromagnetic shielding performance of the whole machine equipment) and dust-proof filter (to ensure the dustproof effect of the whole machine equipment and the air inlet and outlet positions) are added. , to realize the forced air cooling and heat dissipation of the internal ...

AI Technical Summary

Problems solved by technology

[0002] The heat dissipation, electromagnetic shielding and dustproof schemes of the existing electronic equipment such as computers or servers are basically by adding fans at the positions of the front and rear cover plates of the chassis or adding fans at the positions of the upper and lower cover plates, and adding corresponding air ducts and air deflectors inside the chassis. At the same time, air inlet and outlet holes are opened on the corresponding side, and components such as shielding waveguide structure (to ensure good electromagnetic shielding performance of the whole machine equipment) and dust-proof filter (to ensure the dustproof effect of the whole machine equipment and the air inlet and outlet positions) are added. , to realize the forced air cooling and heat dissipation of the internal modules of the chassis and the whole equipment, so as to ensure that the functional modules in electronic equipment such as computers or servers can still work normally when the ambient temperature is above 55°C; in addition, the existing hardened computers or hardened servers For electronic equipment such as products, generally the front cover of the case has to be removed to insert or replace the functional modules inside the case, which is inconvenient for operation and maintenance; the replacement of the fan module takes a long time, and the device needs to be powered off first Operation, only after removing the front and rear covers and top and bottom covers of the chassis can a single fan or module be replaced, poor maintainability

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