Non-conductive film having heating function and electronic device
A non-conductive, thin-film technology, applied in the direction of electric heating devices, ohmic resistance heating, and assembly of printed circuits with electrical components
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no. 1 example
[0026] refer to figure 1 and figure 2 As shown, the first embodiment of the present invention provides a non-conductive film F with heating function, which includes: a non-conductive body 20 and a plurality of micro heaters 21 . Wherein, the non-conductive body 20 will change shape (eg, soften or partially melt) when heated, and a plurality of micro heaters 21 can be arranged on or inside the non-conductive body 20 .
[0027] For example, the non-conductive body 20 can be made in advance, and then a plurality of micro heaters 21 are arranged on the top or bottom of the pre-fabricated non-conductive body 20 (that is to say, the pre-fabricated non-conductive body 20 may additionally be provided on the top or bottom end of a prefabricated non-conductive body 20). Or, while making the non-conductive body 20, let a plurality of micro heaters 21 be coated on the inside of the non-conductive body 20 earlier, so that the inside of the non-conductive body 20 after making has a plura...
no. 2 example
[0031] refer to image 3 As shown, the second embodiment of the present invention provides a non-conductive film F with heating function, which includes: a non-conductive body 20 and a plurality of micro heaters 21, the non-conductive body will change shape when heated, and a plurality of micro-heaters The heater 21 may be provided on or inside the non-conductive body 20 . Depend on image 3 and figure 1 The comparison shows that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the non-conductive film F with heating function further includes: a carrier substrate 23 and a carrier substrate 23 An adhesive layer 24 on the upper surface, and the non-conductive body 20 is disposed on the adhesive layer 24 and carried by the carrier substrate 23 . That is to say, the non-conductive thin film F with heating function can be temporarily carried by the carrying substrate 23 through the adhesive l...
no. 3 example
[0033] refer to Figure 4 and Figure 5 As shown, the third embodiment of the present invention provides an electronic device E, which includes: a circuit substrate P, an adapter board B disposed on the circuit substrate P, and at least one electronic chip C carried by the adapter board B , a first non-conductive film F1 arranged between the adapter board B and the circuit substrate P and a second non-conductive film F2 arranged between at least one electronic chip C and the adapter board B, and at least one electronic chip C is electrically connected to the circuit substrate P through the adapter board B. For example, the first non-conductive film F1 or the second non-conductive film F2 can be a non-conductive film F with heating function, and the non-conductive film F with heating function includes a non-conductive body 20 that changes shape when heated And a plurality of micro heaters 21 arranged on or inside the non-conductive body 20 .
[0034] Going a step further, wi...
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