Substrate processing method and substrate processing device
A substrate processing method and substrate technology, which are applied in the fields of surface coating liquid devices, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as adverse effects, and achieve the effect of improving classification accuracy
Pending Publication Date: 2021-05-11
DAINIPPON SCREEN MTG CO LTD
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- Description
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Problems solved by technology
[0004] In addition, in the manufacturing process of the semiconductor substrate, various films remaining on the peripheral edge of the substrate may adversely affect the device surface of the substrate.
Method used
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[0050]Embodiments will be described below with reference to the attached drawings. In addition, the drawings are diagrams schematically shown, and for convenience of description, the structure is omitted or simplified as appropriate. In addition, the mutual relationship of the size and position of the structure etc. which are shown in drawing is not described precisely, and can be changed suitably.
[0051] In addition, in the description below, the same components are given the same reference numerals and shown in the drawings, and the names and functions of these components are also the same. Therefore, detailed descriptions of these constituent elements may be omitted in order to avoid repetition.
[0052]
[0053] figure 1 It is a diagram showing the overall configuration of the substrate processing apparatus 100 . The substrate processing apparatus 100 is an apparatus for processing the substrate W by supplying a processing liquid to the substrate W. As shown in FIG....
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Provided is a substrate processing method which makes it possible to visually monitor the location which is hit by a liquid column of processing fluid which is discharged onto the end section of a substrate. The substrate processing method is equipped with a holding step, a rotation step, a raising step, a bevel treatment step, an imaging step and a monitoring step. The holding step involves holding the substrate using a substrate-holding part. The rotation step involves rotating the substrate by rotating the substrate-holding part. The raising step involves raising a cup member which surrounds the outer circumference of the substrate-holding part, and positioning the upper end of the cup member at an upper end position which is higher than the upper surface of the substrate. The bevel treatment step discharges a treatment fluid onto the end section of the upper surface of the substrate from the discharge port of the nozzle, which is positioned lower than the upper end position. The imaging step involves obtaining a captured image, by imaging with a camera, of an imaging region which is seen from an imaging position above the substrate and includes the processing fluid discharged from the nozzle and a mirror image of the discharge fluid reflected on the upper surface of the substrate. The monitoring step involves visually monitoring the location which is hit by the treatment fluid on the basis of the mirror image and the treatment fluid in the captured image.
Description
technical field [0001] The invention relates to a substrate processing method and a substrate processing device. Background technique [0002] As an apparatus for processing a substrate, a substrate processing apparatus that discharges a processing liquid from a discharge nozzle to the surface of the substrate while rotating the substrate in a horizontal plane is used. The processing liquid that has landed on the substantially center of the substrate from the discharge nozzle spreads over the entire surface of the substrate due to the centrifugal force accompanying the rotation of the substrate, and is scattered outward from the periphery of the substrate. By spreading the processing liquid over the entire surface of the substrate, it is possible to cause the processing liquid to act on the entire surface of the substrate. As the processing liquid, a chemical liquid, a cleaning liquid, or the like corresponding to the processing of the substrate is used. [0003] In such a...
Claims
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IPC IPC(8): H01L21/304B05C11/08H01L21/027
CPCH01L21/304H01L21/027B05C11/08H01L21/67259H01L21/67051H01L21/6708H01L21/02057H01L21/02087H01L21/31111H01L21/32134H01L21/68764B05C11/02
Inventor 犹原英司冲田有史角间央章增井达哉
Owner DAINIPPON SCREEN MTG CO LTD