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Circuit board, camera module and mobile terminal

A camera module and circuit board technology, which is applied to circuits, printed circuits, printed circuit components, etc., can solve the problems of low reliability of camera modules, loose connections, and high resistance.

Inactive Publication Date: 2021-05-14
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the action of pulling force, it is easy to cause loosening of the joints
Moreover, the resistance encountered during the movement is also greater
Therefore, the reliability of the existing camera module is not high when realizing the mobile optical image stabilization of the photosensitive chip

Method used

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  • Circuit board, camera module and mobile terminal
  • Circuit board, camera module and mobile terminal
  • Circuit board, camera module and mobile terminal

Examples

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Embodiment Construction

[0037] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0038] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes ...

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PUM

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Abstract

The invention relates to a circuit board and a camera module, and the first board body of the circuit board can slide under the action of a driving force, thereby driving a photosensitive chip to displace relative to a lens assembly, and achieving optical anti-vibration. The output pin of the second board body of the circuit board can be electrically connected with the mainboard of the mobile terminal, and the second board body is fixed on the base. When the first plate body moves, the position of the second plate body can be kept fixed, so that no pulling is generated between the second plate body and the main plate. Therefore, each joint is effectively prevented from being loosened due to pulling force. Furthermore, the connecting piece can deform along with the movement of the first plate body, so that the movement of the first plate body cannot be limited. Therefore, the resistance borne by the first board body of the circuit board in the sliding process is small. The camera module has relatively high reliability while realizing optical anti-shake. In addition, the invention also provides a mobile terminal.

Description

technical field [0001] The invention relates to the technical field of optical imaging, in particular to a circuit board, a camera module and a mobile terminal. Background technique [0002] Optical image stabilization is a widely recognized anti-shake technology. It compensates the vibrating optical path through movable parts, so as to reduce the blurring of photos. Optical anti-shake technology is mainly divided into two categories, namely lens mobile optical anti-shake, and photosensitive chip mobile optical anti-shake. [0003] The lens-moving optical image stabilization has a complex structure, and is generally not suitable for application in camera modules of mobile terminals. Therefore, the photosensitive chip mobile optical image stabilization has received more and more attention. The core principle of the photosensitive chip mobile optical image stabilization is that under the action of the driving force, the photosensitive chip can be displaced, thereby compensat...

Claims

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Application Information

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IPC IPC(8): H04N5/225H04N5/232H05K1/14H01R12/52
CPCH05K1/147H01R12/52H04N23/50H04N23/57H04N23/55H04N23/54H04N23/687
Inventor 瞿佳佳李勇安在煜
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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