PCB electroplating floating frame
A floating frame and the same technology, applied in the field of circuit board processing equipment, can solve the problems of aggravating the friction between the PCB board and the floating frame, hidden dangers of the film quality, affecting the quality and effect of the PCB board plating
Inactive Publication Date: 2021-05-18
江西志浩电子科技有限公司
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Problems solved by technology
[0004] However, the buoyancy of the prior art floating frame is relatively large, so that the active force of the PCB board and the floating frame is relatively large, thereby aggravating the friction between the PCB board and the floating frame, and affecting the quality and effect of PCB plating; meanwhile, because the bottom of the floating frame is in the Current channeling occurs during the electroplating process, which causes the thickness of the copper plating at the bottom of the PCB board to be too thick, resulting in hidden quality problems of the sandwich film
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[0020] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness, and will fully convey the scope of the invention. communicated to technical staff.
[0021] like Figure 1-2 As shown, a PCB electroplating floating frame includes a side plate 1, a bottom plate 2, a bottom, a connecting block 3 and a baffle plate 6, and there are two side plates 1, which are arranged symmetrically at intervals; a bottom plate 2 is arranged between the side plates 1, The bottom plate 2 is located between the side plates 1, and the distance between the two sides of the bottom plate 2 and the side plates 1 on the same side is the same. The buoyancy is smaller, reduc...
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Abstract
The invention relates to the technical field of circuit board machining equipment, in particular to a PCB electroplating floating frame. The PCB electroplating floating frame comprises side plates, a bottom plate, a bottom, connecting blocks and baffles. The baffles are arranged between the connecting blocks close to one side of the same side plate, the baffles are symmetrically arranged on the two sides of the bottom plate in a V shape, a containing groove is formed between the baffles, the bottom of an electroplating plate is placed in the containing groove and is lower than the two side edges of the containing groove, the whole floating frame is placed in an electroplating groove to be electroplated, and in the electroplating process, a V-shaped shield is arranged at the bottom of the floating frame; and current bottom fluid channeling can be restrained, thus, the problem that an electroplating copper layer at the bottom of a PCB is too thick is solved, and the quality hidden danger of film clamping is eliminated.
Description
technical field [0001] The invention relates to the technical field of circuit board processing equipment, in particular to a floating rack for PCB electroplating. Background technique [0002] In the process of circuit board processing, it is often necessary to perform electroplating on the surface of the circuit board substrate and the conductive holes of the substrate to form a metal layer on the surface of the substrate and the side walls of the conductive holes. Therefore, how to perform electroplating has become a research hotspots. [0003] In the prior art, an electroplating device is often used to electroplate the substrate of the circuit board; the electroplating device includes an electroplating tank and an electroplating floating frame, and the electroplating floating frame includes a floating bar and a stop plate. It is arranged at the bottom of the holding tank. During electroplating, the bottom end of the circuit board substrate is placed in the holding tank...
Claims
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IPC IPC(8): C25D17/08C25D7/00C25D17/00H05K3/18
CPCC25D17/08C25D17/007C25D7/00H05K3/188
Inventor 黄松蔡志浩陈波黄银燕
Owner 江西志浩电子科技有限公司